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公开(公告)号:US20080075308A1
公开(公告)日:2008-03-27
申请号:US11468658
申请日:2006-08-30
申请人: Wen-Chieh Wei , Hong-Ching Her , Shih-Chin Gong , Cyuan-Sian Jeng
发明人: Wen-Chieh Wei , Hong-Ching Her , Shih-Chin Gong , Cyuan-Sian Jeng
CPC分类号: H04R19/005 , B81B3/001 , B81B2201/0257
摘要: A silicon condenser microphone includes a silicon substrate defining an air chamber, a back plate mounted on the silicon substrate, a diaphragm arranged between the silicon substrate and the back plate and a suspension device arranged between the diaphragm and the silicon substrate. The back plate includes at least one acoustic aperture defined therein and a support device formed thereon. The diaphragm is arranged between the silicon substrate and the back plate so that an effective area thereof is determined by the support device. The suspension device is arranged between the diaphragm and the silicon substrate so that lateral movement of the diaphragm is prevented while vertical movement of the diaphragm is allowed. An edge of the diaphragm is abutted against the support device when the diaphragm is moved towards the back plate.
摘要翻译: 硅电容麦克风包括限定空气室的硅衬底,安装在硅衬底上的背板,布置在硅衬底和背板之间的隔膜以及布置在隔膜和硅衬底之间的悬挂装置。 背板包括限定在其中的至少一个声孔和形成在其上的支撑装置。 隔膜布置在硅衬底和背板之间,使得其有效面积由支撑装置确定。 悬挂装置设置在隔膜和硅基板之间,使得隔膜的横向移动被阻止,同时允许隔膜的垂直运动。 当隔膜向后板移动时,隔膜的边缘抵靠支撑装置。