-
公开(公告)号：US12043537B2
公开(公告)日：2024-07-23
申请号：US16990106
申请日：2020-08-11
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Shih-Wei Lin , Chang-Ming Wu , Ting-Jung Chen
CPC classification number: B81B3/001 , B81B1/004 , B81B3/0021 , B81C1/00158 , B81C1/00531 , B81C1/00571 , B81B2201/0257 , B81B2203/0127 , B81B2203/053
Abstract: The present disclosure provides a method of manufacturing a MEMS device. In some embodiments, a first interlayer dielectric layer is formed over a substrate, and a diaphragm is formed over the first interlayer dielectric layer. Then, a second interlayer dielectric layer is formed over the diaphragm. A first etch is performed to form an opening through the second interlayer dielectric layer and the diaphragm and reaching into an upper portion of the first interlayer dielectric layer. A second etch is performed to the first interlayer dielectric layer and the second interlayer dielectric layer to form recesses above and below the diaphragm and to respectively expose a portion of a top surface and a portion of a bottom surface of the diaphragm. A sidewall stopper is formed along a sidewall of the diaphragm into the recesses of the first interlayer dielectric layer and the second interlayer dielectric layer.
-
公开(公告)号：US11910160B2
公开(公告)日：2024-02-20
申请号：US17550716
申请日：2021-12-14
Applicant: Shinsung SoundMotion Co., Ltd.
Inventor： Sangwoo Lee , Kyudong Jung , Jinho Kim
CPC classification number: H04R19/04 , B81B3/001 , B81B3/0072 , H04R7/04 , H04R7/18 , B81B2201/0257 , B81B2203/0127 , B81B2203/0307 , B81B2203/0315 , B81B2203/04 , H04R2201/003
Abstract: The present invention relates to a MEMS acoustic sensor for sensing variable capacitance between a flexible diaphragm and a back plate. The MEMS acoustic sensor is composed of a substrate comprising a cavity, a back plate supported on the substrate and comprising a plurality of through holes, an electrode formed on the inner surface of the back plate, at least one anchor protruding from the back plate toward the substrate, a diaphragm supported by the at least one anchor and deformed by a sound wave introduced from the outside through the cavity, and a stress release unit extending from the edge portion of the back plate and in contact with the substrate.
-
公开(公告)号：US11731871B2
公开(公告)日：2023-08-22
申请号：US17334493
申请日：2021-05-28
Applicant: InvenSense, Inc.
Inventor： Ashfaque Uddin , Daesung Lee , Alan Cuthbertson
CPC classification number: B81C1/00801 , B81B3/001 , B81B7/0025 , B81B7/02 , B81C1/00968 , B81B2201/0235 , B81B2201/0242 , B81B2203/0127 , B81B2207/012 , B81C2201/014 , B81C2201/0132 , B81C2203/036 , B81C2203/0792
Abstract: A method includes forming an etch stop layer over a first side of a device wafer. The method also includes forming a polysilicon layer over the etch stop layer. A handle wafer is fusion bonded to the first side of the device wafer. A eutectic bond layer is formed on a second side of the device wafer. A micro-electro-mechanical system (MEMS) features are etched into the second side of the device wafer to expose the etch stop layer. The exposed etch stop layer is removed to expose the polysilicon layer. The exposed polysilicon layer is removed to expose a cavity formed between the handle wafer and the device wafer.
-
公开(公告)号：US11668925B2
公开(公告)日：2023-06-06
申请号：US16828984
申请日：2020-03-25
Applicant: COMPERTUM MICROSYSTEMS INC.
Inventor： Francis Piu Man
CPC classification number: G02B26/085 , B81B3/001 , B81B3/0051 , B81B2201/042
Abstract: A MEMS micro-mirror device includes a middle substrate, a movable structure, at least one stopper coupled with the movable structure, at least one flexure, an upper cap, and a lower cap. The movable structure includes a micro-mirror plate having a reflective surface. The flexure connects the stopper and the middle substrate. The upper cap, bonded with the middle substrate, has a first opening for allowing the movable structure's movement and has at least one first recess facing a first side of the flexure and a first side of the stopper. The lower cap, bonded with the middle substrate, has a second opening for allowing space for the movement and has at least one second recess facing a second side of the flexure and a second side of the stopper.
-
公开(公告)号：US20180266910A1
公开(公告)日：2018-09-20
申请号：US15914067
申请日：2018-03-07
Applicant: SEIKO EPSON CORPORATION
Inventor： Yusuke MATSUZAWA , Nobuyuki TANAKA
CPC classification number: G01L19/04 , B81B3/001 , B81B3/0072 , B81B7/0038 , B81B2201/0264 , B81B2203/0127 , B81B2207/07 , G01L9/0052 , G01L9/0054 , G01L9/065 , G01L19/0076 , G01L19/0084 , G01L19/06 , G01L19/145
Abstract: A pressure sensor includes a substrate which has a diaphragm that is flexurally deformed by receiving a pressure, a side wall section which is placed on one surface side of the substrate and surrounds the diaphragm in a plan view, and a sealing layer which is placed so as to face the diaphragm through a space and seals the space, wherein the sealing layer includes a first silicon layer which has a through-hole facing the space, a silicon oxide layer which is located on the opposite side to the space with respect to the first silicon layer and seals the through-hole, and a second silicon layer which is located on the opposite side to the space with respect to the silicon oxide layer.
-
Patent Agency Ranking
公开(公告)号：US20180234774A1
公开(公告)日：2018-08-16
申请号：US15897946
申请日：2018-02-15
Applicant: Infineon Technologies AG
Inventor： Arnaud Walther , Alfons Dehe , Gerhard Metzger-Brueckl , Johann Strasser , Carsten Ahrens
CPC classification number: H04R19/04 , B81B3/001 , B81B3/0021 , B81B3/0072 , B81B2201/0257 , B81B2203/0127 , B81B2203/0163 , B81B2203/04 , B81C1/00182 , H04R19/005 , H04R31/003 , H04R2201/003
Abstract: A microelectromechanical microphone includes a reference electrode, a first membrane arranged on a first side of the reference electrode and displaceable by sound to be detected, and a second membrane arranged on a second side of the reference electrode, said second side being situated opposite the first side of the reference electrode, and displaceable by sound to be detected. A region of one from the first and second membranes that is displaceable by sound relative to the reference electrode, independently of said region's position relative to the reference electrode, can comprise a planar section and also an undulatory section adjoining the planar section and arranged in a region of overlap one of the first membrane or the second membrane with the other one of the first membrane and or the second membrane.
-
公开(公告)号：US09988260B2
公开(公告)日：2018-06-05
申请号：US15142381
申请日：2016-04-29
Applicant: FREESCALE SEMICONDUCTOR, INC.
Inventor： Ruben B. Montez , Arvind S. Salian , Robert F. Steimle
CPC classification number: B81B3/001 , B81B2201/0235 , B81B2203/0315 , B81C1/00976 , B81C2201/0132 , B81C2201/115 , B81C2203/0118
Abstract: A surface of a cavity of a MEMS device that is rough to reduce stiction. In some embodiments, the average roughness (Ra) of the surface is 5 nm or greater. In some embodiments, the rough surface is formed by forming one or more layers of a rough oxidizable material, then oxidizing the material to form an oxide layer with a rough surface. Another layer is formed over the oxide layer with the rough surface, wherein the roughness of the oxide layer is transferred to the another layer.
-
公开(公告)号：US20180145612A1
公开(公告)日：2018-05-24
申请号：US15859130
申请日：2017-12-29
Inventor： Yi Heng Tsai , Chia-Hua Chu , Kuei-Sung Chang
IPC: H02N1/00 , B81B3/00 , G01P15/125 , G01P15/08
CPC classification number: H02N1/006 , B81B3/0005 , B81B3/0008 , B81B3/001 , B81B2201/0235 , G01P15/125 , G01P2015/0871 , H02N1/00 , Y10T29/49002
Abstract: A microelectromechanical system (MEMS) device includes a substrate and a movable element at least partially suspended above the substrate and having at least one degree of freedom. The MEMS device further includes a protrusion extending from the substrate and configured to contact the movable element when the movable element moves in the at least one degree of freedom, wherein the protrusion comprises a surface having a water contact angle of higher than about 15° measured in air.
-
公开(公告)号：US20180134542A1
公开(公告)日：2018-05-17
申请号：US15850677
申请日：2017-12-21
Inventor： Lee-Chuan Tseng , Chang-Ming Wu , Shih-Chang Liu , Yuan-Chih Hsieh
CPC classification number: B81B3/001 , B81C1/0092 , B81C1/00936 , B81C1/00944 , B81C1/00952 , B81C1/0096 , B81C1/00984 , B81C1/00992 , B81C2201/0132 , B81C2201/056
Abstract: The present disclosure involves forming a method of fabricating a Micro-Electro-Mechanical System (MEMS) device. A plurality of openings is formed in a first side of a first substrate. A dielectric layer is formed over the first side of the substrate. A plurality of segments of the dielectric layer fills the openings. The first side of the first substrate is bonded to a second substrate that contains a cavity. The bonding is performed such that the segments of the dielectric layer are disposed over the cavity. A portion of the first substrate disposed over the cavity is transformed into a plurality of movable components of a MEMS device. The movable components are in physical contact with the dielectric the layer. Thereafter, a portion of the dielectric layer is removed without using liquid chemicals.
-
公开(公告)号：US20180057350A1
公开(公告)日：2018-03-01
申请号：US15681062
申请日：2017-08-18
Applicant: Robert Bosch GmbH
Inventor： Juergen Mueller
IPC: B81B3/00
CPC classification number: B81B3/001 , B81B3/0051 , B81B2203/0172 , B81B2203/0376
Abstract: A micromechanical system includes a substrate; a functional element that is mounted to as to allow movement in relation to the substrate; and an elastic stop element. The stop element has a first end that is attached to the substrate, and a second end that is configured to engage with the functional element when the functional element is deflected by a predefined amount from a neutral position. The stop element has an elastic configure in a first direction that coincides with a preferred direction of the functional element, and in a second direction that extends at a right angle to the first direction.
-
-
-
-
-
-
-
-
-
Search Results
367
records
(took 0.02 seconds)
