-
公开(公告)号：US20070277419A1
公开(公告)日：2007-12-06
申请号：US11708086
申请日：2007-02-15
Applicant: Wen-Chin Tsai
Inventor： Wen-Chin Tsai
CPC classification number: G02F1/133308 , G02F1/133608 , G02F2001/13332 , G02F2001/133328 , G02F2201/46 , Y10T29/49826
Abstract: A one-piece-form bezel and its manufacturing method are disclosed here. The present invention utilizes a frame element with a one-piece-form rivet and a frame element with and one-piece-form riveting hole to rivet frame elements with each other and to complete the assemble by punching. The present invention is not necessary to utilize extra assembling processes, such as soldering, solvent, adhesive or gluing process, to joint frame elements and is only to utilize the normal punching equipments to form the present one-piece-form bezel.
Abstract translation: 这里公开了一体式挡板及其制造方法。 本发明利用具有一体式铆钉的框架元件和具有一体式铆接孔的框架元件将框架元件彼此铆接并通过冲压完成组装。 本发明不需要利用诸如焊接，溶剂，粘合剂或胶合工艺的附加组装过程到接合框架元件，并且只能利用普通的冲压设备来形成本单件式的挡板。
-
公开(公告)号：USD508008S1
公开(公告)日：2005-08-02
申请号：US29212163
申请日：2004-08-27
Applicant: Wen-Chin Tsai
Designer： Wen-Chin Tsai
-
公开(公告)号：US08427576B2
公开(公告)日：2013-04-23
申请号：US12958406
申请日：2010-12-02
Applicant: Wen-Chin Tsai
Inventor： Wen-Chin Tsai
CPC classification number: H04N5/2253 , H01L27/14618 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014
Abstract: An exemplary image sensor module includes a plate, an image sensor, and a number of conductive wires. The plate includes a top surface, a bottom surface, an light passing through hole, and a number of conductive pads on the top surface. The sensor includes a first surface and a number of bonding pads corresponding to the respective conductive pads. The first surface opposes the bottom surface. The first surface includes a light sensitive region aligned with the through hole, and a light insensitive region surrounding the light sensitive region. The insensitive region is mounted on the bottom surface. The bonding pads are arranged on the light insensitive region. The wires pass through the light passing through hole, and respectively electrically connect the bonding pads to the corresponding conductive pads.
Abstract translation: 示例性的图像传感器模块包括板，图像传感器和多个导电线。 该板包括顶表面，底表面，光通过孔以及顶表面上的多个导电垫。 传感器包括第一表面和与各个导电焊盘对应的多个焊盘。 第一个表面与底面相反。 第一表面包括与通孔对准的光敏区域和围绕光敏区域的不透光区域。 不敏感区域安装在底面上。 接合焊盘布置在光不敏感区域上。 导线穿过光通过孔，并分别将接合焊盘电连接到相应的导电焊盘。
-
公开(公告)号：US20080192412A1
公开(公告)日：2008-08-14
申请号：US11705923
申请日：2007-02-13
Applicant: Wen-Chin Tsai
Inventor： Wen-Chin Tsai
IPC: H05K5/00
CPC classification number: G02F1/133308 , G02F2001/133328
Abstract: The present invention provides an improved flat display panel frame, wherein two L-shape workpieces or four strip-like workpieces are butt-jointed to form a frame body, and the perimeter of the frame body is bent to form an external bent portion, and thus, an flat display panel frame is completed. In the present invention, as the frame body is formed via butt-jointing multiple workpieces, the punching process for the metallic workpiece is more flexible, and an optimal workpiece arrangement can be used to achieve the highest manipulation efficiency of material. Thus, the material is saved, and the material cost is reduced. Further, the scrap is decreased, and the scrap-processing cost is also reduced.
Abstract translation: 本发明提供一种改进的平板显示面板框架，其中两个L形工件或四个条状工件对接接合以形成框架体，并且框体的周边被弯曲以形成外部弯曲部分，并且 因此，完成了平面显示面板框架。 在本发明中，由于通过对接多个工件形成框架体，所以金属制工件的冲压加工更加灵活，可以使用最佳的工件布置来实现材料的最高操作效率。 因此，节省材料，降低材料成本。 此外，废料减少，废料处理成本也降低。
-
公开(公告)号：USD501170S1
公开(公告)日：2005-01-25
申请号：US29209369
申请日：2004-07-15
Applicant: Wen-Chin Tsai
Designer： Wen-Chin Tsai
-
Patent Agency Ranking
公开(公告)号：US08421911B2
公开(公告)日：2013-04-16
申请号：US12958405
申请日：2010-12-02
Applicant: Wen-Chin Tsai
Inventor： Wen-Chin Tsai
CPC classification number: H01L27/14618 , H01L27/14625 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H04N5/2257 , H01L2924/00014
Abstract: An exemplary image sensor module includes a plate, an image sensor, and a number of conductive wires. The plate includes a top surface, a bottom surface, a light passing through hole, a number of spaced receiving holes extending through the top surface and the bottom surface, and a number of conductive pads on the top surface. The receiving holes surround the through hole. The sensor includes a first surface and a number of bonding pads corresponding to the respective conductive pads. The first surface opposes the bottom surface, and is mounted on the bottom surface. The first surface includes a light sensitive region aligned with the through hole, and a light insensitive region surrounding the light sensitive region. The bonding pads are arranged on the light insensitive region. The wires pass through the respective receiving holes, and respectively electrically connect the bonding pads to the corresponding conductive pads.
Abstract translation: 示例性的图像传感器模块包括板，图像传感器和多个导电线。 板包括顶表面，底表面，透光孔，穿过顶表面和底表面延伸的多个间隔的接收孔以及顶表面上的多个导电垫。 接收孔围绕通孔。 传感器包括第一表面和与各个导电焊盘对应的多个焊盘。 第一表面与底面相对，并安装在底面上。 第一表面包括与通孔对准的光敏区域和围绕光敏区域的不透光区域。 接合焊盘布置在光不敏感区域上。 电线穿过相应的接收孔，并将接合焊盘分别电连接到相应的导电焊盘。
-
公开(公告)号：US08074460B2
公开(公告)日：2011-12-13
申请号：US12170915
申请日：2008-07-10
Applicant: An-Bang Wang , Chia-Fong Lee , Wen-Chin Tsai , I-Chun Lin , Fei-Yau Lu , Chih-Chieh Chen , Liang-Jenq Leu , Chuin-Shan Chen , Wen-Pin Shih
Inventor： An-Bang Wang , Chia-Fong Lee , Wen-Chin Tsai , I-Chun Lin , Fei-Yau Lu , Chih-Chieh Chen , Liang-Jenq Leu , Chuin-Shan Chen , Wen-Pin Shih
CPC classification number: F24F5/0046 , F24F6/12 , F24F2006/125 , F24F2110/30 , Y02B30/80
Abstract: A device for adjusting a temperature and a humidity using a wind power is provided. The device includes an inlet; an outlet connected to the inlet; a sprayer spraying a nebulized liquid into the device; and an airflow sensor electrically connected to the sprayer for activating the sprayer when an airflow passes through.
Abstract translation: 提供了一种使用风力来调节温度和湿度的装置。 该装置包括入口; 连接到入口的出口; 喷雾器将喷雾的液体喷射到装置中; 以及气流传感器，其电连接到喷雾器，用于当空气流通过时激活喷雾器。
-
8.发明申请Structure of one-piece-form 3-dimensional bezel and manufacturing method thereof 审中-公开一件式三维边框的结构及其制造方法公开(公告)号：US20080151479A1
公开(公告)日：2008-06-26
申请号：US11823448
申请日：2007-06-26
Applicant: Wen-Chin Tsai
Inventor： Wen-Chin Tsai
IPC: H05K5/02
CPC classification number: G02F1/133308 , G02F2001/133328
Abstract: A one-piece-form 3-dimentional bezel and its manufacturing method are disclosed here. The present invention utilizes a 3-dimentional frame element with one-piece-form rivet portions on a top side and on a lateral side and a 3-dimentional frame element with one-piece-form riveting holes on a top side and a lateral side to rivet 3-dimentional frame elements with each other and to complete the assemble by punching. The present invention is not necessary to utilize extra assembling processes, such as soldering, melting, adhesive or gluing process, to joint frame elements and is only to utilize the normal punching equipments to form the present one-piece-form 3-dimentional bezel.
Abstract translation: 这里公开了一体式三维表圈及其制造方法。 本发明使用在顶侧和侧面上具有一体式铆钉部分的三维框架元件和在顶侧和侧面上具有单件式铆接孔的3维框架元件 将三维框架元件彼此铆接，并通过冲压完成组装。 本发明不需要对接头框架元件采用诸如焊接，熔化，粘合或胶合加工的额外的组装过程，并且只能利用普通冲压设备来形成本发明的单件式三维表圈。
-
公开(公告)号：USD504376S1
公开(公告)日：2005-04-26
申请号：US29211085
申请日：2004-08-11
Applicant: Wen-Chin Tsai
Designer： Wen-Chin Tsai
-
公开(公告)号：USD501169S1
公开(公告)日：2005-01-25
申请号：US29209368
申请日：2004-07-15
Applicant: Wen-Chin Tsai
Designer： Wen-Chin Tsai
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.013 seconds)
