公开(公告)号：US08240057B2

公开(公告)日：2012-08-14

申请号：US12107495

申请日：2008-04-22

申请人： Wen-Pin Shih ,  Yao-Chuan Tsai ,  Duo-Ru Chang ,  Li-Chi Tsao ,  Ming-Dao Wu ,  Po-Jen Shih

发明人： Wen-Pin Shih ,  Yao-Chuan Tsai ,  Duo-Ru Chang ,  Li-Chi Tsao ,  Ming-Dao Wu ,  Po-Jen Shih

IPC分类号： G01B5/008

CPC分类号： G01B1/00 ,  G01B5/012

摘要： A method of manufacturing a self-aligned stylus with high sphericity includes the steps of: forming a polymeric layer on a substrate; placing a sphere on the polymeric layer; softening the polymeric layer to make a portion of the sphere sink into the polymeric layer; forming a specific light absorbing layer on the polymeric layer; illuminating the sphere and the specific light absorbing layer with specific light such that the specific light is focused by the sphere to expose the polymeric layer to form an exposed portion and an unexposed portion; removing the specific light absorbing layer; and baking the polymeric layer and then removing the unexposed portion. A self-aligned stylus with high sphericity is also disclosed.

摘要翻译： 制造具有高球形度的自对准触控笔的方法包括以下步骤：在基底上形成聚合物层; 将球体放置在聚合物层上; 软化聚合物层以使球体的一部分沉入聚合物层中; 在聚合物层上形成特定的光吸收层; 用特定光照射球体和特定光吸收层，使得特定的光被球体聚焦以暴露聚合物层以形成暴露部分和未曝光部分; 去除特定光吸收层; 并烘烤聚合物层，然后除去未曝光部分。 还公开了具有高球形度的自对准手写笔。

公开(公告)号：US08464589B2

公开(公告)日：2013-06-18

申请号：US12904169

申请日：2010-10-14

申请人： Chien-Hsing Lee ,  Tsung-Min Hsieh ,  Li-Chi Tsao ,  Jhyy-Cheng Liou

发明人： Chien-Hsing Lee ,  Tsung-Min Hsieh ,  Li-Chi Tsao ,  Jhyy-Cheng Liou

IPC分类号： G01L7/08

CPC分类号： B81B3/0072 ,  B81B2201/0257 ,  H04R19/005

摘要： A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings.

摘要翻译： MEMS结构包括基板，结构介电层和隔膜。 结构介电层设置在衬底上。 隔膜由外周端的结构介电层保持。 隔膜包括围绕隔膜的中心区域的周边区域的多个沟槽/脊环。 波纹结构位于隔膜的中心区域，被沟槽/压痕环包围。

公开(公告)号：US20120090398A1

公开(公告)日：2012-04-19

申请号：US12904169

申请日：2010-10-14

申请人： Chien-Hsing Lee ,  Tsung-Min Hsieh ,  Li-Chi Tsao ,  Jhyy-Cheng Liou

发明人： Chien-Hsing Lee ,  Tsung-Min Hsieh ,  Li-Chi Tsao ,  Jhyy-Cheng Liou

IPC分类号： G01L7/08

CPC分类号： B81B3/0072 ,  B81B2201/0257 ,  H04R19/005

摘要： A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings.

摘要翻译： MEMS结构包括基板，结构介电层和隔膜。 结构介电层设置在衬底上。 隔膜由外周端的结构介电层保持。 隔膜包括围绕隔膜的中心区域的周边区域的多个沟槽/脊环。 波纹结构位于隔膜的中心区域，被沟槽/压痕环包围。