公开(公告)号：US20070010111A1

公开(公告)日：2007-01-11

申请号：US11521158

申请日：2006-09-14

申请人： William Brodsky ,  James Busby ,  Bruce Chamberlin ,  Mitchell Ferrill ,  Robin Susko ,  James Wilcox

发明人： William Brodsky ,  James Busby ,  Bruce Chamberlin ,  Mitchell Ferrill ,  Robin Susko ,  James Wilcox

IPC分类号： H01R12/00

CPC分类号： H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0501 ,  H01L2224/05011 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R4/01 ,  H01R12/52 ,  H05K3/325 ,  H05K2201/068 ,  H05K2201/209 ,  H05K2203/1105 ,  H01L2224/05099

摘要： A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.

公开(公告)号：US20060205273A1

公开(公告)日：2006-09-14

申请号：US10906810

申请日：2005-03-08

申请人： William Brodsky ,  James Busby ,  Bruce Chamberlin ,  Mitchell Ferrill ,  Robin Susko ,  James Wilcox

发明人： William Brodsky ,  James Busby ,  Bruce Chamberlin ,  Mitchell Ferrill ,  Robin Susko ,  James Wilcox

IPC分类号： H01R13/40

CPC分类号： H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0501 ,  H01L2224/05011 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R4/01 ,  H01R12/52 ,  H05K3/325 ,  H05K2201/068 ,  H05K2201/209 ,  H05K2203/1105 ,  H01L2224/05099

摘要： A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.

摘要翻译： 公开了一种用于形成用于半导体封装的可移除互连的方法和结构，其中连接器适于在经受温度变化时从第一形状重复地变为第二形状，并且在不受影响时重复地返回到第一形状 到温度变化。 当连接器处于其第二形状时，连接器可以断开，并且当连接器处于其第一形状时连接器不能断开。