公开(公告)号：US20100051501A1

公开(公告)日：2010-03-04

申请号：US12201553

申请日：2008-08-29

申请人： William E. Corbin, JR. ,  Alison K. Easton ,  James E. Fluegel ,  Christopher W. Long ,  James H. Peterman ,  Laura Mauer

发明人： William E. Corbin, JR. ,  Alison K. Easton ,  James E. Fluegel ,  Christopher W. Long ,  James H. Peterman ,  Laura Mauer

IPC分类号： B65D85/00

CPC分类号： H01L21/67393

摘要： A wafer carrying structure is provided that allows more efficient operation of the opening and closing mechanisms. More specifically, the wafer carrier includes pressure relief structures that provide appropriate pressure equalization during the opening and closing operations of the wafer carrier. This allows doors on the wafer to be more easily opened and closed while also providing significant environmental isolation for the wafers during transport operations. Relief structures specifically designed to remain closed except for those brief periods of time where pressure relief is necessary to equalize pressure during opening and closing of the carrier.

摘要翻译： 提供了允许更有效地操作打开和关闭机构的晶片承载结构。 更具体地，晶片载体包括在晶片载体的打开和关闭操作期间提供适当的压力平衡的压力释放结构。 这允许晶片上的门更容易地打开和关闭，同时还在运输操作期间为晶片提供显着的环境隔离。 特别设计为保持关闭的救济结构，除了需要压力释放以在打开和关闭载体的过程中平衡压力的短暂时间内。