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    Low density polymers and methods of making and using same
    1.
    发明授权
    Low density polymers and methods of making and using same 失效
    低密度聚合物及其制造和使用方法

    公开(公告)号：US6020387A

    公开(公告)日：2000-02-01

    申请号：US934744

    申请日：1997-09-22

    申请人： William J. Downey ,  Christopher Andreola ,  Paul R. Lydigsen ,  Wayne E. Wright

    发明人： William J. Downey ,  Christopher Andreola ,  Paul R. Lydigsen ,  Wayne E. Wright

    IPC分类号： C08G18/36 ,  C08K3/00 ,  C08G18/06

    CPC分类号： C08G18/36 ,  C08K3/0008

    摘要： A low density polymer composition including a polymer component capable of being cured, a low density filler in an amount sufficient to reduce the density of the polymer and a thixotrope present in a sufficient amount to impart a sufficient viscosity and to inhibit separation of the filler from the polymer until after the polymer is cured. The resulting lightweight, filled polymer composition is a strong electrical insulator, has low shrinkage, a low coefficient of thermal expansion, low cured density and a soft filler that does not harden the polymer. Methods of preparing and using the low density polymer compositions are also disclosed.

    摘要翻译： 包含能够固化的聚合物组分的低密度聚合物组合物，足以降低聚合物密度的量的低密度填料和足以赋予足够粘度并且抑制填料的分离的触变剂 直到聚合物固化之后。 所得到的轻质填充聚合物组合物是强电绝缘体，具有低收缩率，低热膨胀系数，低固化密度和不使聚合物硬化的软填料。 还公开了制备和使用低密度聚合物组合物的方法。