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公开(公告)号：US5152052A
公开(公告)日：1992-10-06
申请号：US721195
申请日：1991-06-26
CPC分类号： H05K13/0491 , B25B27/02 , Y10T29/53283 , Y10T29/53896 , Y10T29/53943
摘要： A hand operable tool is provided for removing a memory module printed circuit board from an underlying processor board without an appreciable risk of bending the pins of the pin-and-socket connectors used to removably secure the circuit board to the processor board. The tool comprises a generally inverted U-shaped outer frame structure having a pair of parallel, inturned bottom pressure plates secured to its lower ends. A shorter, generally inverted U-shaped inner frame structure is slidably retained within the outer frame structure and has a pair of parallel, inturned upper pressure plates secured to its lower ends. The inner frame structure is spring-biased to a lower limit position in which the upper pressure plates engage the bottom pressure plates, and a pair of elongated upper and lower handle members are connected to the frame structures. To remove the circuit board, the pressure plates are positioned beneath opposite underside edge portions of the board and the tool handles are vertically squeezed toward one another to vertically separate the upper pressure plates from the bottom pressure plates. This causes the bottom pressure plates to bear against the processor board, and the upper pressure plates to simultaneously bear against the underside edge portions of the circuit board and vertically lift them to remove the circuit board without bending its associated connector pins.
摘要翻译： 提供一种手动操作工具，用于从下面的处理器板移除存储模块印刷电路板，而不会有明显的弯曲用于可拆卸地将电路板固定到处理器板的插针连接器的销的引脚的风险。 该工具包括大致倒U形的外框架结构，其具有固定到其下端的一对平行的，内压的底压板。 较短的，大致倒置的U形内框架结构可滑动地保持在外框架结构内，并且具有固定到其下端的一对平行的内向上压板。 内部框架结构被弹簧偏压到下部压力板接合底部压力板的下限位置，并且一对细长的上部和下部手柄构件连接到框架结构。 为了去除电路板，压板位于板的相对的下边缘部分下方，并且工具把手彼此垂直地挤压，以将上压板从底部压力板垂直分离。 这使得底部压板抵靠处理器板，并且上压板同时承受电路板的下侧边缘部分并且垂直地提升它们以移除电路板而不使其相关联的连接器引脚弯曲。
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