摘要:
To increase the heat capacity of a heat sink and heat dissipating structure combined with an electrical component, typically a transistor, for example of the TO 220 or SOT 93 type, a heat transferring base plate (3), with the interposition of an insulating, heat conducting foil (6), engages one flat surface of the element (11), and a second heat transferring element (17) is provided, pressed by a spring (24) against the other major surface, or a portion of the component (11). A plastic holder (7) is provided, attached to the base plate (3) for example by snap-in hooks (8), formed with openings to receive the component, and position the component against the base plate while, also, being formed with abutments to position the second heat transferring element which, for example, is block or plate-like. The spring, preferably, is a leaf spring having projecting arms extending, from both sides of a central portion (25), over two adjacently located components (11) and the second heat transferring elements (17) respectively, and engaging the holder (7) to form a subassembly therewith, the subassembly then being riveted, by rivets extending through the spring (24) to the base plate.
摘要:
To permit one-hand operation of engagement and disengagement of separable electrical connectors, for example of multi-terminal connectors in automotive use, the connectors are formed with adjacent side walls fitting within each other; the inner side walls of one part are formed with locking projections extending laterally outwardly and having at least one flat engaging surface extending transversely to unlocking direction, and fitting against a matching engaging surface formed on the side wall of the other part. To permit unlocking, the inner side wall is formed with a projecting fulcrum bead or ridge, the side wall of the other part being extended beyond the fulcrum bead or ridge so that, upon compression of the extending portion over the fulcrum bead or ridge, the side wall of the other part will be resiliently deflected outwardly, thus releasing the engagement surfaces from each other.
摘要:
A method for the attachment of electrical components to circuit boards where the electrical components are enclosed by a housing and held in place by a retaining device. The method enables a smaller and more compact construction for switching devices. The connection of the electrical components with the housing enclosing them creates a additional point for the absorption of thermal and mechanical stresses in addition to the connection with the circuit board.
摘要:
A pressure equalizing element for an electronic device enclosure, e.g. for a control device under the hood of a vehicle, features a water-tight but air-transmitting region (21) which equalizes pressure between the interior airspace of the enclosure and ambient airspace. The element preferably includes a porous PTFE foil element which is bowed so that water will not pool on it and clog the air pores. Thus, it will be operative, and can be installed, in any desired orientation. The foil is protected against puncture by surrounding support elements of metal and/or plastic and is adapted to be automatically mass-produced and tested prior to installation.