公开(公告)号：US20240045408A1

公开(公告)日：2024-02-08

申请号：US17878938

申请日：2022-08-02

Applicant: Winbond Electronics Corp.

Inventor： Kazuhiro Segawa ,  Chiang-Sheng Liu

IPC: G05B19/418 ,  H01J37/28 ,  H01L21/66

CPC classification number: G05B19/41885 ,  H01J37/28 ,  G05B19/41875 ,  H01L22/12 ,  G05B2219/45031 ,  G05B2219/37224 ,  G05B2219/37127

Abstract: A dynamic sampling method and device for semiconductor manufacture are provided. The dynamic sampling method includes: generating an N-dimensional virtual image of a wafer based on a design rule and at least one of a quality control data and context data; measuring a critical pattern in the N-dimensional virtual image to generate a virtual metrology result by using a virtual metrology; determining whether the virtual metrology result is larger than a threshold; not performing a measurement on the wafer in a case that the virtual metrology result is larger than the threshold; and performing the measurement on the wafer in a case that the virtual metrology result is not larger than the threshold.