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公开(公告)号：US20240045408A1
公开(公告)日：2024-02-08
申请号：US17878938
申请日：2022-08-02
Applicant: Winbond Electronics Corp.
Inventor： Kazuhiro Segawa , Chiang-Sheng Liu
IPC: G05B19/418 , H01J37/28 , H01L21/66
CPC classification number: G05B19/41885 , H01J37/28 , G05B19/41875 , H01L22/12 , G05B2219/45031 , G05B2219/37224 , G05B2219/37127
Abstract: A dynamic sampling method and device for semiconductor manufacture are provided. The dynamic sampling method includes: generating an N-dimensional virtual image of a wafer based on a design rule and at least one of a quality control data and context data; measuring a critical pattern in the N-dimensional virtual image to generate a virtual metrology result by using a virtual metrology; determining whether the virtual metrology result is larger than a threshold; not performing a measurement on the wafer in a case that the virtual metrology result is larger than the threshold; and performing the measurement on the wafer in a case that the virtual metrology result is not larger than the threshold.
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公开(公告)号：US20230375914A1
公开(公告)日：2023-11-23
申请号：US17750408
申请日：2022-05-23
Applicant: Winbond Electronics Corp.
Inventor： Kazuhiro Segawa , Isao Tanaka
Abstract: A semiconductor manufacturing apparatus and a semiconductor manufacturing method thereof are provided. Wafers are grouped into a first wafer group and a second wafer group according to alignment mark position errors of the wafers and a first threshold value. The alignment mark position errors of the first wafer group are greater than the first threshold value, and the alignment mark position errors of the second wafer group are less than or equal to the first threshold value. A feedforward position correction value is calculated according to a difference between the alignment mark position errors of the first wafer group and a reference error value. A lithography process is performed on the wafers according to the feedforward position correction value.
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