公开(公告)号：US20230118367A1

公开(公告)日：2023-04-20

申请号：US17504546

申请日：2021-10-19

Applicant: Winbond Electronics Corp.

Inventor： Wen-Chieh Tsai ,  Cheng-Ta Yang ,  Tsung-Wei Lin

IPC: H01L23/528 ,  H01L21/768

Abstract: Provided is a memory device, including: a substrate; a plurality of word lines, extending in a first direction, arranged in a second direction, disposed on the substrate; a dummy structure, adjacent to ends of the word lines, disposed on the substrate, wherein the dummy structure includes a main part that extends in the second direction; and a plurality of extension parts, extending in the first direction, connected to the main part, and interposed between the main part and the word lines.

公开(公告)号：US11876048B2

公开(公告)日：2024-01-16

申请号：US17504546

申请日：2021-10-19

Applicant: Winbond Electronics Corp.

Inventor： Wen-Chieh Tsai ,  Cheng-Ta Yang ,  Tsung-Wei Lin

IPC: H01L21/00 ,  H01L23/528 ,  H01L21/768

CPC classification number: H01L23/528 ,  H01L21/76816

Abstract: Provided is a memory device, including: a substrate; a plurality of word lines, extending in a first direction, arranged in a second direction, disposed on the substrate; a dummy structure, adjacent to ends of the word lines, disposed on the substrate, wherein the dummy structure includes a main part that extends in the second direction; and a plurality of extension parts, extending in the first direction, connected to the main part, and interposed between the main part and the word lines.