Target for a sputtering source
    1.
    发明申请
    Target for a sputtering source 审中-公开
    溅射源的目标

    公开(公告)号:US20070251814A1

    公开(公告)日:2007-11-01

    申请号:US11789514

    申请日:2007-04-24

    IPC分类号: C23C14/32 C23C14/00

    摘要: A target for a sputtering source can be subdivided into a plurality of exchangeable target segments (9). Each target segment (9) contains coating material, wherein each target segment (9) borders on at least two adjacent target segments (9′, 9″), wherein each target segment is connectable to a base body (2, 13, 15) by means of at most one securing means (7, 8, 10).

    摘要翻译: 溅射源的靶可以被细分为多个可交换靶区段(9)。 每个目标段(9)包含涂层材料,其中每个目标区段(9)在至少两个相邻的目标区段(9',9“)上相邻,其中每个目标区段可连接到基体(2,13,15 )通过至多一个固定装置(7,8,10)。

    Target holding apparatus
    2.
    发明申请
    Target holding apparatus 审中-公开
    目标保持装置

    公开(公告)号:US20070215462A1

    公开(公告)日:2007-09-20

    申请号:US11724045

    申请日:2007-03-13

    IPC分类号: C23C14/00

    摘要: An apparatus for the attachment of a target or target segment (9) of a coating source includes a target or target segment (9) and a target holder (1) which includes a cooling body (3) and connecting means (6,7,8,11) for the attachment of the target or target segment to the cooling body. The connecting means include (3,6,7,8,10,11) electrically and/or thermally conductive means, so that the power supply takes place in a uniform distribution across the target or target segment, and also the heat arising at the target or target segment during the coating method can be uniformly conducted away into the cooling body, by which means more power can be coupled into the coating source and the coating rate is raised.

    摘要翻译: 用于附着涂料源的目标区段(9)的装置包括目标区段(目标区段)和目标区段(1),目标区段(1)包括冷却体(3)和连接装置(6,7, 8,11)用于将目标段或目标段附接到冷却体。 连接装置包括(3,6,7,8,10,11)电和/或导热装置,使得电源以均匀的分布发生在目标部分或目标部分上,而且在 在涂布方法中的目标或目标段可以均匀地传导到冷却体中,由此可以使更多的功率耦合到涂层源中并且涂覆速率提高。

    Securing device for a sputtering source
    3.
    发明申请
    Securing device for a sputtering source 审中-公开
    用于溅射源的固定装置

    公开(公告)号:US20090120783A1

    公开(公告)日:2009-05-14

    申请号:US11724048

    申请日:2007-03-13

    IPC分类号: C23C14/34

    CPC分类号: H01J37/3497 H01J37/3435

    摘要: A securing device for a sputtering source in a sputtering space includes a current transmitting means (2, 10, 13, 15, 16, 17, 18) of electrically and thermally conductive material for the conducting of a current to the sputtering source and also a screening means (1, 4, 5, 6, 12) for the screening of the current transmitting means from the sputtering space, so that the current transmitting means can be electrically insulated from the sputtering space, characterised in that temperature resistant means (1, 5) are provided to guarantee a temperature resistance and a resistance to electrical discharges of the securing device, in particular at temperatures up to 1150° C.

    摘要翻译: 用于溅射空间中的溅射源的固定装置包括用于传导到溅射源的电流的导热材料的电流传输装置(2,10,13,15,16,17,18),还有一个 筛选装置(1,4,5,6,12),用于从溅射空间筛选电流传输装置,使得电流传输装置可以与溅射空间电绝缘,其特征在于,耐温装置(1, 5)用于保证固定装置的耐温性和耐放电性,特别是在高达1150°C的温度下。