公开(公告)号：US20220352141A1

公开(公告)日：2022-11-03

申请号：US17867801

申请日：2022-07-19

申请人： Wolfspeed, Inc.

发明人： Saurabh Goel ,  Alexander Komposch ,  Cynthia Blair ,  Cristian Gozzi

IPC分类号： H01L25/00 ,  H01L23/66 ,  H01L23/36 ,  H01L23/538

摘要： A multi-cavity package includes a single metal flange having first and second opposing main surfaces. The multi-cavity package also includes a dielectric material attached to the first main surface of the single metal flange. The dielectric material includes a first surface facing the single metal flange, and a second surface facing away from the first surface. The dielectric material also includes a plurality of openings exposing different regions of the first main surface of the single metal flange. The dielectric material also includes a lateral extension that overhangs the single metal flange. A corresponding method of manufacturing is also provided.

公开(公告)号：US11437362B2

公开(公告)日：2022-09-06

申请号：US16589624

申请日：2019-10-01

申请人： Wolfspeed, Inc.

发明人： Saurabh Goel ,  Alexander Komposch ,  Cynthia Blair ,  Cristian Gozzi

IPC分类号： H01L23/495 ,  H01L25/00 ,  H01L23/66 ,  H01L23/36 ,  H01L23/538 ,  H01L25/065

摘要： A multi-cavity package includes a single metal flange having first and second opposing main surfaces. The multi-cavity package also includes a circuit board attached to the first main surface of the single metal flange. The circuit board includes a first surface facing the single metal flange, and a second surface facing away from the first surface. The circuit board also includes a plurality of openings exposing different regions of the first main surface of the single metal flange. The circuit board also includes a lateral extension that overhangs the single metal flange. A corresponding method of manufacturing is also provided.