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公开(公告)号:US06980172B2
公开(公告)日:2005-12-27
申请号:US10780642
申请日:2004-02-19
申请人: Won Il Kwak , Seong Ook Park
发明人: Won Il Kwak , Seong Ook Park
CPC分类号: H01Q1/38 , H01Q9/0407 , H01Q9/0442 , H01Q13/203 , H01Q13/28
摘要: The present invention is directed to a multi-band cable antenna. A multi-band cable antenna according to the present invention comprises: a dielectric substrate, as a nonconductive dielectric having a predetermined dielectric constant, with a plurality of conductive microstrips formed on the top and bottom sides of the substrate, for inducing a resonance in the multi-band; signal transfer means including the first and second conductors for signal transfer, which are electrically separated from each other by a layer of insulator, the first conductor for signal transfer configured to be short-circuited with one of microstrips formed on the top side of the dielectric substrate; a conductive solder ball for physically coupling one of the conductors for signal transfer with the microstrips formed on the top side of the dielectric substrate; and an upper and lower short-circuited conductor for short-circuited the second conductor for signal transfer on the signal transfer means with one of the micristrips formed on the bottom side of the dielectric substrate, wherein the upper and lower short-circuited conductor and the microstrips formed on the bottom side circuit-shorted with the second conductor of signal transfer are electrically grounded.
摘要翻译: 本发明涉及一种多频带电缆天线。 根据本发明的多频带电缆天线包括:作为具有预定介电常数的非导电电介质的电介质基板,在基板的顶侧和底侧形成多个导电微带,用于在 多频段 信号传送装置,包括用于信号传送的第一和第二导体,它们通过一层绝缘体彼此电分离,用于信号传输的第一导体被配置为与形成在电介质顶部上的微带之一短路 基质; 导电焊球,用于物理耦合用于信号传送的导体之一与形成在电介质基板的顶侧上的微带; 以及用于短路第二导体的上下短路导体,用于信号传送装置上的信号传输,其中形成在电介质基板的底侧上的一个夹芯,其中上下短路导体和 形成在与第二导体信号传输短路的底侧电路上的微带电接地。
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公开(公告)号:US07170456B2
公开(公告)日:2007-01-30
申请号:US11194703
申请日:2005-08-02
申请人: Won Il Kwak , Seong Ook Park
发明人: Won Il Kwak , Seong Ook Park
CPC分类号: H01Q1/2283 , H01Q1/22 , H01Q1/243 , H01Q9/0421
摘要: Disclosed herein is a dielectric chip antenna structure using a metal conductor formed at the lateral side of the antenna along the longitudinal direction of the antenna. The dielectric chip antenna structure forms the metal conductor at the long side of the antenna to induce antenna resonance through coupling effect between the antenna and the ground. Furthermore, the dielectric chip antenna structure minimizes the space occupied by the antenna and modifies the theoretical feeding structures of the reverse F type antenna and monopole antenna to meet user's various demands.
摘要翻译: 这里公开了使用在天线的横向方向上沿着天线的纵向形成的金属导体的电介质芯片天线结构。 电介质芯片天线结构在天线的长边形成金属导体,以通过天线和地面之间的耦合效应引起天线共振。 此外,电介质芯片天线结构最小化天线占用的空间,并修改反向F型天线和单极天线的理论馈电结构,以满足用户的各种需求。
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公开(公告)号:US06982675B2
公开(公告)日:2006-01-03
申请号:US10780641
申请日:2004-02-19
申请人: Won Il Kwak , Seong Ook Park , Young Hyuk Ko
发明人: Won Il Kwak , Seong Ook Park , Young Hyuk Ko
IPC分类号: H01Q1/24
CPC分类号: H01Q9/42 , H01Q1/243 , H01Q5/371 , H01Q9/0414
摘要: The present invention is directed to an internal multi-band antenna with multiple layers and which comprises a main radiation patch for forming an upper side of the antenna, one side of the main radiation patch connected to a feeder, the main radiation patch including a plurality of strips in the same plane and formed by a folded slit patch of maze type; and at least one auxiliary radiation patch bent downwardly at one side of an edge of the main radiation patch and formed in parallel to the main radiation patch between the main radiation patch and a feeder ground plane.
摘要翻译: 本发明涉及一种具有多层的内部多频带天线,其包括用于形成天线的上侧的主辐射贴片,主辐射贴片的一侧连接到馈线,主辐射贴片包括多个 的条带在同一平面内,由折叠的迷宫式狭缝贴片形成; 以及至少一个辅助辐射片,其在所述主辐射片的边缘的一侧向下弯曲并且与所述主辐射贴片和馈送器接地平面之间的主辐射贴片平行地形成。
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公开(公告)号:USD559532S1
公开(公告)日:2008-01-15
申请号:US29272836
申请日:2007-02-21
申请人: Won Il Kwak , Hwi Tae Lim
设计人: Won Il Kwak , Hwi Tae Lim
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公开(公告)号:USD569830S1
公开(公告)日:2008-05-27
申请号:US29270768
申请日:2007-01-04
申请人: Won Il Kwak
设计人: Won Il Kwak
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公开(公告)号:USD567500S1
公开(公告)日:2008-04-29
申请号:US29273701
申请日:2007-03-12
申请人: Won Il Kwak , Hwi Tae Lim
设计人: Won Il Kwak , Hwi Tae Lim
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公开(公告)号:USD565840S1
公开(公告)日:2008-04-08
申请号:US29269846
申请日:2006-12-11
申请人: Won Il Kwak
设计人: Won Il Kwak
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公开(公告)号:USD546810S1
公开(公告)日:2007-07-17
申请号:US29261105
申请日:2006-06-08
申请人: Won Il Kwak
设计人: Won Il Kwak
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