公开(公告)号：US20250076122A1

公开(公告)日：2025-03-06

申请号：US18239185

申请日：2023-08-29

Applicant: X DEVELOPMENT LLC

Inventor： Artsem Artsemenka ,  Phillip Yee ,  Carl Turner ,  Russell Shikami

IPC: G01J5/02 ,  G01J5/04 ,  G01J5/24

Abstract: A device includes a casing, circuitry within the casing, and a temperature sensor. The temperature sensor is connected to the circuitry and is attached to the casing in such a way that an air gap separates the temperature sensor from the casing. The temperature sensor is attached to the casing in a bridge. The bridge includes a first backing and a second backing, which includes a grommet. The temperature sensor is positioned between a portion of the first backing and a portion of the second backing, and includes a flex lead that is electrically connected through the grommet of the second backing to the circuitry inside the casing.