公开(公告)号：US20250036848A1

公开(公告)日：2025-01-30

申请号：US18227225

申请日：2023-07-27

Applicant: XILINX, INC.

Inventor： Aashish TRIPATHI ,  Sundeep Ram Gopal AGARWAL ,  Ashit DEBNATH ,  Atreyee SAHA ,  Praful JAIN

IPC: G06F30/398 ,  G06F30/392

Abstract: A method for predicting voltage drop on a power delivery network of a 3D stacked device includes receiving a spatial power distribution map of a plurality of semiconductor dies of the 3D stacked device, receiving a spatial power source node location map for a plurality of power source nodes coupled to the 3D stacked device, dividing vertically the spatial power distribution map and the spatial power source node location map into overlapping windows, determining a voltage drop map in each of the windows based on the divided spatial power distribution map and the divided spatial power source node location map, and combining the voltage drop map in each of the windows to form a composite voltage drop map.