公开(公告)号：US20240329110A1

公开(公告)日：2024-10-03

申请号：US18128942

申请日：2023-03-30

Applicant: XILINX, INC.

Inventor： Zhaoyin Daniel WU ,  Tianyu FANG ,  Chuen-Huei CHOU ,  Christopher J. BORRELLI ,  Geoffrey ZHANG

IPC: G01R31/11 ,  G01R31/52

CPC classification number: G01R31/11 ,  G01R31/52

Abstract: Using “in-situ on-die time-domain reflectometry (TDR)” with data signal paths of integrated circuits, printed circuit boards, and data processing equipment and systems allows testing, verification and troubleshooting of data channel signal path impedance variations including the package, escape routing, socket, board, and cable/connectors provides fast characterization thereof. Operation of “in-situ on-die TDR” uses existing analog-to-digital converter (ADC) and data transmitter (TX) drivers of an integrated circuit to act as a TDR sampling head by performing a user interface-based TDR sampling with a step-waveform generated by an integrated circuit TX driver. Then sampling the step-waveform with the ADC of the integrated circuit using spline interpolation to obtain the over-sampled waveform. Once the sampled step-waveform is obtained, the TDR profile of the sampled data channels may be calculated. Large amounts of impedance variation data may thus be collected during either integrated circuit manufacturer or customer-built data communications channel testing.