公开(公告)号：US20240291487A1

公开(公告)日：2024-08-29

申请号：US18115588

申请日：2023-02-28

Applicant: XILINX, INC.

Inventor： Li-Yang CHEN ,  Chi Fung POON ,  Chuen-Huei CHOU

IPC: H03K17/693 ,  H03K17/00

CPC classification number: H03K17/693 ,  H03K17/005 ,  H04B1/0483 ,  H04B1/40

Abstract: A transmission system is disclosed including a driver circuit. The driver circuit includes multiplexer circuits that receive parallel data and operate as a differential pair. At least one of the multiplexer circuits is coupled to a first circuit node and a second circuit node of the driver circuit. The at least one the multiplexer circuits outputs serial data from the multiplexer circuits at the first and second circuit nodes. The first and second nodes are coupled to a differential output network. The first and second nodes are coupled to an inductor circuit. The first and second nodes are coupled to a cross-coupled circuit. The inductor circuit drains driver circuit current at the first circuit node. The second circuit node and the cross-coupled circuit steer driver circuit current at the first circuit node and the second circuit node.

公开(公告)号：US20240329110A1

公开(公告)日：2024-10-03

申请号：US18128942

申请日：2023-03-30

Applicant: XILINX, INC.

Inventor： Zhaoyin Daniel WU ,  Tianyu FANG ,  Chuen-Huei CHOU ,  Christopher J. BORRELLI ,  Geoffrey ZHANG

IPC: G01R31/11 ,  G01R31/52

CPC classification number: G01R31/11 ,  G01R31/52

Abstract: Using “in-situ on-die time-domain reflectometry (TDR)” with data signal paths of integrated circuits, printed circuit boards, and data processing equipment and systems allows testing, verification and troubleshooting of data channel signal path impedance variations including the package, escape routing, socket, board, and cable/connectors provides fast characterization thereof. Operation of “in-situ on-die TDR” uses existing analog-to-digital converter (ADC) and data transmitter (TX) drivers of an integrated circuit to act as a TDR sampling head by performing a user interface-based TDR sampling with a step-waveform generated by an integrated circuit TX driver. Then sampling the step-waveform with the ADC of the integrated circuit using spline interpolation to obtain the over-sampled waveform. Once the sampled step-waveform is obtained, the TDR profile of the sampled data channels may be calculated. Large amounts of impedance variation data may thus be collected during either integrated circuit manufacturer or customer-built data communications channel testing.

公开(公告)号：US20230198562A1

公开(公告)日：2023-06-22

申请号：US17559592

申请日：2021-12-22

Applicant: XILINX, INC.

Inventor： Chi Fung POON ,  Chuen-Huei CHOU ,  Weerachai NEERANARTVONG ,  Kevin ZHENG

IPC: H04B1/04 ,  H03M1/74 ,  H03M1/66

CPC classification number: H04B1/0483 ,  H03M1/74 ,  H03M1/662

Abstract: A DAC-based transmit driver architecture with improved bandwidth and techniques for driving data using such an architecture. One example transmit driver circuit generally includes an output node and a plurality of digital-to-analog converter (DAC) slices. Each DAC slice has an output coupled to the output node of the transmit driver circuit and includes a bias transistor having a drain coupled to the output of the DAC slice and a multiplexer having a plurality of inputs and an output coupled to a source of the bias transistor.