On-die virtual probes (ODVP) for integrated circuitries

    公开(公告)号:US11428733B1

    公开(公告)日:2022-08-30

    申请号:US17339223

    申请日:2021-06-04

    Applicant: XILINX, INC.

    Abstract: Some examples described herein provide for an on-die virtual probe in an integrated circuit structure for measurement of voltages. In an example, an integrated circuit comprises a voltage-controlled frequency oscillator circuitry and a processor circuitry. The voltage-controlled frequency oscillator circuitry comprises a plurality of circuitry components and is configured to generate a signal having a frequency related to a supply voltage. The voltage-controlled frequency oscillator circuitry is disposed at a location of the integrated circuit proximal to the supply voltage being monitored. The processor circuitry is configured to identify a relationship between the frequency of the signal and the supply voltage. The processor circuitry is also configured to determine a value of the supply voltage associated with the signal based on the identified relationship. The processor circuitry further monitors on-die transient voltages at the location of the integrated circuit based on the value of the supply voltage.

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