公开(公告)号：US11246211B1

公开(公告)日：2022-02-08

申请号：US17188795

申请日：2021-03-01

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Nagadeven Karunakaran ,  Hoa Do ,  Suresh Ramalingam

IPC: H05K1/02

Abstract: Micro devices having enhanced through printed circuit board (PCB) heat transfer are provided. In one example, a micro device is provided that includes a PCB, a thermal management device, a chip package, a bracket, and a plurality of extra-package heat conductors. The chip package has a first side facing the thermal management device and a second side mounted to a first side of the PCB. The bracket is disposed on a second side of the PCB that faces away from the chip package. The plurality of extra-package heat conductors are disposed laterally outward of the chip package and provide at least a portion of a thermally conductive heat transfer path between the bracket and the thermal management device through the PCB.