公开(公告)号：US20240329329A1

公开(公告)日：2024-10-03

申请号：US18129765

申请日：2023-03-31

申请人： XILINX, INC.

发明人： Gamal REFAI-AHMED ,  Chuan Xie ,  Chi-Yi Chao ,  Suresh Ramalingam ,  Nagadeven Karunakaran ,  Ferdinand F. Fernandez

IPC分类号： G02B6/38 ,  G02B6/42

CPC分类号： G02B6/3849 ,  G02B6/381 ,  G02B6/4295

摘要： A method of fabricating a chip package is provided, and a chip package fabricated using the same are provided. The method includes connecting a photonic die to a substrate of the chip package and attaching a protection apparatus to the substrate. The method also includes attaching a photonic connector to the photonic die. At least a portion of the photonic connector is disposed inside a housing of the protection apparatus. A fabrication process is performed on the chip package while the photonic connector is inside the housing. After processing, the photonic connector is removed from the housing.

公开(公告)号：US11246211B1

公开(公告)日：2022-02-08

申请号：US17188795

申请日：2021-03-01

申请人： XILINX, INC.

发明人： Gamal Refai-Ahmed ,  Nagadeven Karunakaran ,  Hoa Do ,  Suresh Ramalingam

IPC分类号： H05K1/02

摘要： Micro devices having enhanced through printed circuit board (PCB) heat transfer are provided. In one example, a micro device is provided that includes a PCB, a thermal management device, a chip package, a bracket, and a plurality of extra-package heat conductors. The chip package has a first side facing the thermal management device and a second side mounted to a first side of the PCB. The bracket is disposed on a second side of the PCB that faces away from the chip package. The plurality of extra-package heat conductors are disposed laterally outward of the chip package and provide at least a portion of a thermally conductive heat transfer path between the bracket and the thermal management device through the PCB.