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公开(公告)号：US12136613B2
公开(公告)日：2024-11-05
申请号：US17669252
申请日：2022-02-10
Applicant: XILINX, INC.
Inventor： Li-Sheng Weng , Suresh Ramalingam , Hong Shi
Abstract: A chip package and method for fabricating the same are provided that includes a near-die integrated passive device. The near-die integrated passive device is disposed between a package substrate and an integrated circuit die of a chip package. Some non-exhaustive examples of an integrated passive device that may be disposed between the package substrate and the integrated circuit die include a resistor, a capacitor, an inductor, a coil, a balum, or an impedance matching element, among others.
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