公开(公告)号：US11961823B1

公开(公告)日：2024-04-16

申请号：US17354927

申请日：2021-06-22

Applicant: XILINX, INC.

Inventor： Praful Jain ,  Martin Voogel ,  Brian Gaide

IPC: H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L24/16 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2924/15311

Abstract: Examples described herein generally relate to forming and/or configuring a die stack in a multi-chip device. An example is a method of forming a multi-chip device. Dies are formed. At least two or more of the dies are interchangeable. Characteristics of the at least two or more of the dies that are interchangeable are determined. A die stack comprising the at least two or more of the dies that are interchangeable is formed. Respective placements within the die stack of the at least two or more of the dies that are interchangeable are based on the characteristics.

公开(公告)号：US11043480B1

公开(公告)日：2021-06-22

申请号：US16437498

申请日：2019-06-11

Applicant: XILINX, INC.

Inventor： Praful Jain ,  Martin Voogel ,  Brian Gaide

IPC: H01L25/00 ,  H01L21/66 ,  H01L25/065

Abstract: Examples described herein generally relate to forming and/or configuring a die stack in a multi-chip device. An example is a method of forming a multi-chip device. Dies are formed. At least two or more of the dies are interchangeable. Characteristics of the at least two or more of the dies that are interchangeable are determined. A die stack comprising the at least two or more of the dies that are interchangeable is formed. Respective placements within the die stack of the at least two or more of the dies that are interchangeable are based on the characteristics.