Integrated circuit package with voltage droop mitigation

    公开(公告)号:US11950358B1

    公开(公告)日:2024-04-02

    申请号:US17357089

    申请日:2021-06-24

    Applicant: XILINX, INC.

    CPC classification number: H05K1/0262

    Abstract: A semiconductor device system comprises an integrated circuit (IC) die. The IC die is configured to operate in a first operating mode during a first period, and a second operating mode during a second period. The first period is associated with enabling an element of the IC die and a first amount of voltage droop. The second period occurs after the first period and is associated with a second amount of voltage droop. The second amount of voltage droop is less than the first amount of voltage droop.

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