公开(公告)号：US20190140012A1

公开(公告)日：2019-05-09

申请号：US16178483

申请日：2018-11-01

Applicant: XINTEC INC.

Inventor： Hsin KUAN ,  Shih-Kuang CHEN ,  Chin-Ching HUANG ,  Chia-Ming CHENG

IPC: H01L27/146 ,  H01L23/00 ,  H01L21/56

Abstract: A chip package includes a chip structure, a molding material, a conductive layer, a redistribution layer, and a passivation layer. The chip structure has a front surface, a rear surface, a sidewall, a sensing area, and a conductive pad. The molding material covers the rear surface and the sidewall. The conductive layer extends form the conductive pad to the molding material located on the sidewall. The redistribution layer extends form the molding material that is located on the rear surface to the molding material that is located on the sidewall. The redistribution layer is in electrical contact with an end of the conductive layer facing away from the conductive pad. The passivation layer is located on the molding material and the redistribution layer. The passivation layer has an opening, and a portion of the redistribution layer is located in the opening.

公开(公告)号：US20170330871A1

公开(公告)日：2017-11-16

申请号：US15590302

申请日：2017-05-09

Applicant: XINTEC INC.

Inventor： Hsin KUAN ,  Chin-Ching HUANG ,  Chia-Ming CHENG

IPC: H01L25/16 ,  H01L31/0203 ,  H01L25/00

CPC classification number: H01L25/167 ,  H01L24/19 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2924/14 ,  H01L2924/141 ,  H01L2924/143 ,  H01L2924/1461 ,  H01L2924/18162 ,  H01L2924/37001

Abstract: A chip package includes a sensing chip, a computing chip, and a protective layer annularly surrounding the sensing chip and the computing chip. The sensing chip has a first conductive pad, a sensing element, a first surface and a second surface opposite to each other. And the sensing element is disposed on the first surface. The computing chip has a second conductive pad and a computing element. The protective layer is formed by lamination and at least exposes the sensing element. The chip package further includes a conductive layer underneath the second surface of the sensing chip and extending to be in contact with the first conductive pad and the second conductive pad.