公开(公告)号：US20160344444A1

公开(公告)日：2016-11-24

申请号：US14992552

申请日：2016-01-11

Applicant: Xiaomi Inc.

Inventor： Dawei YANG ,  Hui LI ,  Dan ZHU ,  Chunli XU

IPC: H04B3/28 ,  H05K7/14 ,  H05K9/00 ,  H04M1/02

CPC classification number: H05K9/0064 ,  H04M1/0277 ,  H05K7/1417 ,  H05K9/0024

Abstract: A circuit protection structure and a device including the same are provided. The circuit protection structure includes: a printed circuit board (PCB) motherboard, a middle frame connected to the PCB motherboard, and a conductive adhesive layer. The PCB motherboard is disposed in a portable electronic device. The PCB motherboard has a circuit unit mounted thereon and a grounded wireframe surrounding a periphery of the circuit unit where the circuit unit contacts the PCB motherboard. The middle frame includes a conductive housing at least partially covering the PCB motherboard the conductive housing having a cavity to enclose the circuit unit. The conductive adhesive layer is disposed between the grounded wireframe and the conductive housing for electrical connection between the grounded wireframe and the conductive housing.

Abstract translation: 提供了电路保护结构和包括该电路保护结构的装置。 电路保护结构包括：印刷电路板（PCB）主板，连接到PCB主板的中间框架和导电粘合剂层。 PCB母板设置在便携式电子设备中。 PCB母板具有安装在其上的电路单元和围绕电路单元的周边的接地线框，其中电路单元接触PCB主板。 中间框架包括至少部分地覆盖PCB母板的导电外壳，导电外壳具有用于封闭电路单元的空腔。 导电粘合剂层设置在接地线框架和导电壳体之间，用于在接地线框架和导电壳体之间进行电连接。

公开(公告)号：US20160164234A1

公开(公告)日：2016-06-09

申请号：US14799286

申请日：2015-07-14

Applicant: Xiaomi Inc.

Inventor： Hui LI ,  Wei SUN ,  Jie FAN

IPC: H01R24/58

CPC classification number: H01R24/58 ,  H01R13/111 ,  H01R13/2485 ,  H01R13/6471 ,  H01R24/22 ,  H01R2105/00 ,  H04R2420/00

Abstract: The present disclosure relates to an earphone socket, an earphone plug, an earphone and an electronic device. For example, the earphone socket may include a socket body in which an earphone jack is formed. The earphone socket may include multiple ground terminals, which may be arranged in the earphone jack. The ground terminals may contact a ground section disposed on an earphone plug when the earphone plug is inserted into the earphone jack. The technical solutions of the present disclosure reduce earphone crosstalk and improve tone quality.

Abstract translation: 本公开涉及耳机插座，耳机插头，耳机和电子设备。 例如，耳机插座可以包括其中形成有耳机插孔的插座主体。 耳机插座可以包括可以布置在耳机插孔中的多个接地端子。 当耳机插头插入到耳机插孔中时，接地端子可以接触设置在耳机插头上的接地部分。 本公开的技术方案减少了耳机串扰并提高了音质。