In-die transistor characterization in an IC

    公开(公告)号:US10379155B2

    公开(公告)日:2019-08-13

    申请号:US14505240

    申请日:2014-10-02

    Applicant: Xilinx, Inc

    Abstract: In an example implementation, an integrated circuit (IC) includes: a plurality of transistors disposed in a plurality of locations on a die of the IC; conductors coupled to terminals of each of the plurality of transistors; a digital-to-analog converter (DAC), coupled to the conductors, to drive voltage signals to the plurality of transistors in response to a digital input; and an analog-to-digital converter (ADC), coupled to at least a portion of the conductors, to generate samples in response to current signals induced in the plurality of transistors in response to the voltage signals, the samples being indicative of at least one electrostatic characteristic for the plurality of transistors.

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