公开(公告)号：US09023676B2

公开(公告)日：2015-05-05

申请号：US14166749

申请日：2014-01-28

Applicant: Xintec Inc.

Inventor： Chih-Hao Chen ,  Bai-Yao Lou ,  Shih-Kuang Chen

IPC: H01L21/00 ,  H01L27/146 ,  H01L21/20

CPC classification number: H01L27/14687 ,  H01L21/2007 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A wafer packaging method includes the following steps. A light transmissive carrier is provided. A hydrolytic temporary bonding layer is formed on the light transmissive carrier. A first surface of a light transmissive protection sheet is bonded to the hydrolytic temporary bonding layer, such that the hydrolytic temporary bonding layer is located between the light transmissive protection sheet and the light transmissive carrier. A second surface of the light transmissive protection sheet facing away from the first surface is bonded to a third surface of a wafer. The light transmissive carrier, the hydrolytic temporary bonding layer, the light transmissive protection sheet, and the wafer are immersed in a high temperature liquid, such that adhesion force of the hydrolytic temporary bonding layer is eliminated. The light transmissive protection sheet and the wafer are obtained from the high temperature liquid.

Abstract translation: 晶片封装方法包括以下步骤。 提供透光载体。 在透光性载体上形成水解性临时粘接层。 透光性保护片的第一表面与水解性临时粘合层接合，使得水解临时粘结层位于透光保护片和透光性载体之间。 透光保护片的背离第一表面的第二表面被结合到晶片的第三表面。 透光载体，水解临时粘合层，透光保护片和晶片浸入高温液体中，从而消除了水解临时粘合层的粘附力。 透光保护片和晶片是从高温液体中获得的。