公开(公告)号：US20250056911A1

公开(公告)日：2025-02-13

申请号：US18751148

申请日：2024-06-21

Applicant: Xintec Inc.

Inventor： Wei-Luen SUEN ,  Chien Wei CHANG ,  Zi-Yu LIAO ,  Jiun-Yen LAI ,  Tsang Yu LIU

IPC: H01L27/146 ,  H01L21/78 ,  H01L23/00 ,  H01L23/498

Abstract: A chip package includes a semiconductor substrate, a light-transmissive plate, a bonding layer, and a light-shielding layer. The bonding layer is located between the semiconductor substrate and the light-transmissive plate. The semiconductor substrate, the bonding layer, and the light-transmissive plate jointly define a sidewall including a first region and a second region. The first region extends from the semiconductor substrate to the light-transmissive plate, and is recessed relative to the second region. The light-shielding layer covers the sidewall and includes an extending portion, a wide portion, and a narrow portion. The extending portion is located on a surface of the semiconductor substrate facing away from the bonding layer. The wide portion is located on the first region of the sidewall. The narrow portion is located on the second region of the sidewall.