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公开(公告)号:US20220120627A1
公开(公告)日:2022-04-21
申请号:US17566326
申请日:2021-12-30
Applicant: Yokogawa Electric Corporation
Inventor: Takashi YOSHIDA , Yuusaku YOSHIDA , Atsushi YUMOTO , Yoshitaka SUZUKI
Abstract: A resonant pressure sensor includes a first substrate and a resonator. The first substrate includes a diaphragm and a projection disposed on the diaphragm. The resonator is disposed in the first substrate, a part of the resonator being included in the projection, and the resonator being disposed between a top of the projection and an intermediate level of the first substrate. The first substrate is an SOI substrate in which a silicon dioxide layer is inserted between a silicon substrate and a superficial silicon layer. The intermediate level of the first substrate is disposed in the silicon substrate, and the resonator is disposed in the projection included in the superficial silicon layer.
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2.
公开(公告)号:US20150047434A1
公开(公告)日:2015-02-19
申请号:US14460684
申请日:2014-08-15
Applicant: YOKOGAWA ELECTRIC CORPORATION
Inventor: Takashi Yoshida , Yuusaku YOSHIDA , Atsushi YUMOTO , Yoshitaka SUZUKI
CPC classification number: G01L7/082 , G01L7/022 , G01L7/08 , G01L9/0008 , G01L9/0047 , Y10T29/4913
Abstract: A resonant pressure sensor includes a first substrate including a diaphragm and at least one projection disposed on the diaphragm, and at least one resonator disposed in the first substrate, at least a part of the resonator being included in the projection, and the resonator being disposed between a top of the projection and an intermediate level of the first substrate.
Abstract translation: 谐振压力传感器包括:第一衬底,包括隔膜和设置在隔膜上的至少一个突起;以及设置在第一衬底中的至少一个谐振器,所述谐振器的至少一部分包括在所述突起中,并且所述谐振器被布置 在所述突起的顶部和所述第一基板的中间水平面之间。
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