Adjustable rinse flow in semiconductor processing
    1.
    发明申请
    Adjustable rinse flow in semiconductor processing 审中-公开
    在半导体加工中可调冲洗流

    公开(公告)号:US20050229976A1

    公开(公告)日:2005-10-20

    申请号:US10826054

    申请日:2004-04-16

    IPC分类号: F16K31/365 G05D7/01 G05D16/06

    摘要: In the manufacture of semiconductor devices, a system and method for delivering gas at a predetermined rate of flow is disclosed, which includes: a flow controller having a diaphragm forming upstream and downstream chambers; a regulator for delivering gas to the upstream chamber of the flow controller at a substantially constant pressure, the controller having an outlet from the downstream chamber which is opened and closed by the diaphragm; an urging means for urging the diaphragm toward its closed position; and a valve for selectively adjusting the spring force to achieve the predetermined rate of flow without having to use a gas flow measurement device to monitor the flow rate.

    摘要翻译: 在半导体装置的制造中,公开了一种以预定流量传送气体的系统和方法,其包括:具有形成上游和下游室的隔膜的流量控制器; 用于以基本上恒定的压力将气体输送到流量控制器的上游室的调节器,所述控制器具有来自下游室的出口,所述出口由隔膜打开和关闭; 用于将隔膜推向其关闭位置的推动装置; 以及用于选择性地调节弹簧力以实现预定流量的阀,而不必使用气体流量测量装置来监测流量。