公开(公告)号：US10103041B2

公开(公告)日：2018-10-16

申请号：US13535209

申请日：2012-06-27

申请人： Yasuhiro Suzuki ,  Yasuyoshi Hongashi

发明人： Yasuhiro Suzuki ,  Yasuyoshi Hongashi

IPC分类号： H04N7/18 ,  H01L21/67 ,  H05K13/08

摘要： A component transfer apparatus includes: an upthrust section that thrusts up a wafer component held by a wafer holding table from below; an extraction head that suctions the wafer component thrust up by the upthrust section or an adjustment chip placed on the upthrust section; an imaging section that performs imaging of the wafer component or the adjustment chip being suctioned by the extraction head; and a control section that controls driving of the extraction head and operations of the imaging section. Upon suction position adjustment, the control section causes the imaging section to perform imaging of the wafer component or the adjustment chip being suctioned by the extraction head, and adjusts a suction position of the wafer component by the extraction head based on a result of the imaging.

公开(公告)号：US08339445B2

公开(公告)日：2012-12-25

申请号：US12666853

申请日：2008-05-15

申请人： Shinya Yoro ,  Kazuhiro Kobayashi ,  Yasuhiro Suzuki ,  Yasunori Naitoh ,  Yasuyoshi Hongashi

发明人： Shinya Yoro ,  Kazuhiro Kobayashi ,  Yasuhiro Suzuki ,  Yasunori Naitoh ,  Yasuyoshi Hongashi

IPC分类号： H01L21/68 ,  H01L21/00

CPC分类号： H01L21/67144 ,  H01L21/681

摘要： [Problems]To provide a component placing apparatus capable of effectively preventing the occurrence of a suction error by appropriately adjusting a displacement between respective coordinate systems of a placing head and imaging device while efficiently performing suction position recognition using the imaging device that is movable independently of the placing head.[Means for Solving the Problems]A component mounting apparatus (1) includes a placing head (4) that transports a chip component (6) supplied from a component supply portion (5) by sucking the chip component (6), and a suction position recognition camera (32) that is provided to be movable independently of the placing head (4) and takes an image of the chip component (6) before the placing head (4) sucks the chip component (6) from the component supply portion (5). A control unit (40) that controls an operation of the component mounting apparatus (1) checks a correlation of the respective coordinate systems of the placing head (4) and the suction position recognition camera (32) at predetermined timing and corrects an amount of movement when the placing head (4) accesses the chip component (6) in the component supply portion (5) on the basis of this correlation.

摘要翻译： 本发明提供一种能够通过适当地调整放置头和成像装置的各坐标系之间的位移而有效地防止吸引误差的发生的部件放置装置，同时使用能够独立于 放置头。 （解决问题的方案）一种部件安装装置（1），包括：放置头（4），其通过吸取芯片部件（6）来输送从部件供给部（5）供给的芯片部件（6） 位置识别摄像机（32），其被设置为能够独立于所述放置头（4）移动，并且在所述放置头（4）从所述部件供给部分（4）吸取所述芯片部件（6）之前拍摄所述芯片部件（6）的图像， （5）。 控制部件安装装置（1）的操作的控制单元（40）在预定定时检查放置头（4）和抽吸位置识别摄像机（32）的各坐标系的相关性，并校正 基于该相关性，放置头（4）进入部件供给部（5）中的芯片部件（6）时的移动。

公开(公告)号：US20100220183A1

公开(公告)日：2010-09-02

申请号：US12666853

申请日：2008-05-15

申请人： Shinya Yoro ,  Kazuhiro Kobayashi ,  Yasuhiro Suzuki ,  Yasunori Naitoh ,  Yasuyoshi Hongashi

发明人： Shinya Yoro ,  Kazuhiro Kobayashi ,  Yasuhiro Suzuki ,  Yasunori Naitoh ,  Yasuyoshi Hongashi

IPC分类号： H04N7/18

CPC分类号： H01L21/67144 ,  H01L21/681

摘要： [Problems] To provide a component placing apparatus capable of effectively preventing the occurrence of a suction error by appropriately adjusting a displacement between respective coordinate systems of a placing head and imaging device while efficiently performing suction position recognition using the imaging device that is movable independently of the placing head.[Means for Solving the Problems] A component mounting apparatus (1) includes a placing head (4) that transports a chip component (6) supplied from a component supply portion (5) by sucking the chip component (6), and a suction position recognition camera (32) that is provided to be movable independently of the placing head (4) and takes an image of the chip component (6) before the placing head (4) sucks the chip component (6) from the component supply portion (5). A control unit (40) that controls an operation of the component mounting apparatus (1) checks a correlation of the respective coordinate systems of the placing head (4) and the suction position recognition camera (32) at predetermined timing and corrects an amount of movement when the placing head (4) accesses the chip component (6) in the component supply portion (5) on the basis of this correlation.

摘要翻译： 本发明提供一种能够通过适当地调整放置头和成像装置的各坐标系之间的位移而有效地防止吸引误差的发生的部件放置装置，同时使用能够独立于 放置头。 （解决问题的方案）一种部件安装装置（1），包括：放置头（4），其通过吸取芯片部件（6）来输送从部件供给部（5）供给的芯片部件（6） 位置识别摄像机（32），其被设置为能够独立于所述放置头（4）移动，并且在所述放置头（4）从所述部件供给部分（4）吸取所述芯片部件（6）之前拍摄所述芯片部件（6）的图像， （5）。 控制部件安装装置（1）的操作的控制单元（40）在预定定时检查放置头（4）和抽吸位置识别摄像机（32）的各坐标系的相关性，并校正 基于该相关性，放置头（4）进入部件供给部（5）中的芯片部件（6）时的移动。