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公开(公告)号：US08126026B2
公开(公告)日：2012-02-28
申请号：US12395084
申请日：2009-02-27
IPC分类号： H01S5/00
CPC分类号： H01S5/4031 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/30107 , H01S5/02208 , H01S5/02244 , H01S5/02469 , H01S5/4087 , H01L2924/00014 , H01L2924/00
摘要： A two-beam semiconductor laser device 10 includes: a two-beam semiconductor element LDC having a first and a second semiconductor laser elements LD1 and LD2 that can be driven independently and that are formed integrally on a substrate; and a submount 63 having, mounted on a front part thereof, the two-beam semiconductor laser element LDC with the light-emitting face thereof directed forward and having a first and a second electrode pads 64 and 65 connected to electrodes 61 and 62 of the first and second semiconductor laser element LD1 and LD2 by being kept in contact therewith. The first and second electrode pads 64 and 65 are formed to extend farther behind the two-beam semiconductor laser element LDC, and wires 14 and 16 are wire-bonded behind the two-beam semiconductor laser element LDC.
摘要翻译： 双光束半导体激光器装置10包括：具有第一和第二半导体激光元件LD1和LD2的双光束半导体元件LDC，其可独立驱动并且一体地形成在基板上; 以及安装在其前部的双光束半导体激光元件LDC的基座63，其中发光面向前指向并具有连接到电极61和62的第一和第二电极焊盘64和65。 第一和第二半导体激光元件LD1和LD2通过保持与其接触。 第一和第二电极焊盘64和65形成为在双光束半导体激光元件LDC之后延伸得更远，并且导线14和16被引线键合在双光束半导体激光元件LDC的后面。
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公开(公告)号：US20070063212A1
公开(公告)日：2007-03-22
申请号：US10575899
申请日：2004-10-12
IPC分类号： H01L33/00
CPC分类号： H01S5/02244 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01S5/02208 , H01L2924/00014
摘要： In a semiconductor laser device 10 including a semiconductor laser element 14, a frame 12 having a front face on which the semiconductor laser element 14 is placed, and a resin molded portion 15 that covers the front and back faces of the frame 12, on a front face side of the frame 12, the semiconductor laser element 14 is enclosed with an enclosure portion 15b of the resin molded portion 15, and the resin molded portion 15 has an open front serving as a laser beam emission window 15a. On a back face side of the frame 12, there is provided an exposed portion 16e enclosed with a U-shaped enclosure portion 15d of the resin molded portion 15, the exposed portion 16e where the frame 12 is exposed to the outside.
摘要翻译： 在包括半导体激光元件14的半导体激光器装置10中，具有放置半导体激光元件14的正面的框架12和覆盖框架12的前后面的树脂模制部15， 框架12的前表面侧，半导体激光元件14被树脂模制部分15的封闭部分15b包围，并且树脂模制部分15具有用作激光束发射窗口15a的开放前部。 在框架12的背面侧设置有由树脂模制部分15的U形外壳部分15d以及框架12暴露于外部的暴露部分16e包围的暴露部分16e。
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公开(公告)号：US08290015B2
公开(公告)日：2012-10-16
申请号：US12395123
申请日：2009-02-27
IPC分类号： H01S5/00
CPC分类号： H01S5/4031 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/30107 , H01S5/02208 , H01S5/02244 , H01S5/02469 , H01S5/4087 , H01L2924/00014 , H01L2924/00
摘要： A two-beam semiconductor laser device 10 includes: a two-beam semiconductor element LDC having a first and a second semiconductor laser elements LD1 and LD2 that can be driven independently and that are formed integrally on a substrate; and a submount 63 having, mounted on a front part thereof, the two-beam semiconductor laser element LDC with the light-emitting face thereof directed forward and having a first and a second electrode pads 64 and 65 connected to electrodes 61 and 62 of the first and second semiconductor laser element LD1 and LD2 by being kept in contact therewith. The first and second electrode pads 64 and 65 are formed to extend farther behind the two-beam semiconductor laser element LDC, and wires 14 and 16 are wire-bonded behind the two-beam semiconductor laser element LDC.
摘要翻译： 双光束半导体激光器装置10包括：具有第一和第二半导体激光元件LD1和LD2的双光束半导体元件LDC，其可独立驱动并且一体地形成在基板上; 以及安装在其前部的双光束半导体激光元件LDC的基座63，其中发光面向前指向并具有连接到电极61和62的第一和第二电极焊盘64和65 第一和第二半导体激光元件LD1和LD2通过保持与其接触。 第一和第二电极焊盘64和65形成为在双光束半导体激光元件LDC之后延伸得更远，并且导线14和16被引线键合在双光束半导体激光元件LDC的后面。
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公开(公告)号：US07724798B2
公开(公告)日：2010-05-25
申请号：US10575680
申请日：2004-10-12
IPC分类号： H01S5/00
CPC分类号： H01S5/4031 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/30107 , H01S5/02208 , H01S5/02244 , H01S5/02469 , H01S5/4087 , H01L2924/00014 , H01L2924/00
摘要： A two-beam semiconductor laser device 10 includes: a two-beam semiconductor element LDC having a first and a second semiconductor laser elements LD1 and LD2 that can be driven independently and that are formed integrally on a substrate; and a submount 63 having, mounted on a front part thereof, the two-beam semiconductor laser element LDC with the light-emitting face thereof directed forward and having a first and a second electrode pads 64 and 65 connected to electrodes 61 and 62 of the first and second semiconductor laser element LD1 and LD2 by being kept in contact therewith. The first and second electrode pads 64 and 65 are formed to extend farther behind the two-beam semiconductor laser element LDC, and wires 14 and 16 are wire-bonded behind the two-beam semiconductor laser element LDC.
摘要翻译： 双光束半导体激光器装置10包括：具有第一和第二半导体激光元件LD1和LD2的双光束半导体元件LDC，其可独立驱动并且一体地形成在基板上; 以及安装在其前部的双光束半导体激光元件LDC的基座63，其中发光面向前指向并具有连接到电极61和62的第一和第二电极焊盘64和65。 第一和第二半导体激光元件LD1和LD2通过保持与其接触。 第一和第二电极焊盘64和65形成为在双光束半导体激光元件LDC之后延伸得更远，并且导线14和16被引线键合在双光束半导体激光元件LDC的后面。
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公开(公告)号：US20090161718A1
公开(公告)日：2009-06-25
申请号：US12395084
申请日：2009-02-27
CPC分类号： H01S5/4031 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/30107 , H01S5/02208 , H01S5/02244 , H01S5/02469 , H01S5/4087 , H01L2924/00014 , H01L2924/00
摘要： A two-beam semiconductor laser device 10 includes: a two-beam semiconductor element LDC having a first and a second semiconductor laser elements LD1 and LD2 that can be driven independently and that are formed integrally on a substrate; and a submount 63 having, mounted on a front part thereof, the two-beam semiconductor laser element LDC with the light-emitting face thereof directed forward and having a first and a second electrode pads 64 and 65 connected to electrodes 61 and 62 of the first and second semiconductor laser element LD1 and LD2 by being kept in contact therewith. The first and second electrode pads 64 and 65 are formed to extend farther behind the two-beam semiconductor laser element LDC, and wires 14 and 16 are wire-bonded behind the two-beam semiconductor laser element LDC.
摘要翻译： 双光束半导体激光器装置10包括：具有第一和第二半导体激光元件LD1和LD2的双光束半导体元件LDC，其可独立驱动并且一体地形成在基板上; 以及安装在其前部的双光束半导体激光元件LDC的基座63，其中发光面向前指向并具有连接到电极61和62的第一和第二电极焊盘64和65。 第一和第二半导体激光元件LD1和LD2通过保持与其接触。 第一和第二电极焊盘64和65形成为在双光束半导体激光元件LDC之后延伸得更远，并且导线14和16被引线键合在双光束半导体激光元件LDC的后面。
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公开(公告)号：US07339194B2
公开(公告)日：2008-03-04
申请号：US10575899
申请日：2004-10-12
IPC分类号： H01L27/15
CPC分类号： H01S5/02244 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01S5/02208 , H01L2924/00014
摘要： In a semiconductor laser device 10 including a semiconductor laser element 14, a frame 12 having a front face on which the semiconductor laser element 14 is placed, and a resin molded portion 15 that covers the front and back faces of the frame 12, on a front face side of the frame 12, the semiconductor laser element 14 is enclosed with an enclosure portion 15b of the resin molded portion 15, and the resin molded portion 15 has an open front serving as a laser beam emission window 15a. On a back face side of the frame 12, there is provided an exposed portion 16e enclosed with a U-shaped enclosure portion 15d of the resin molded portion 15, the exposed portion 16e where the frame 12 is exposed to the outside.
摘要翻译： 在包括半导体激光元件14的半导体激光器装置10中，具有放置半导体激光元件14的正面的框架12和覆盖框架12的前后面的树脂模制部15， 框架12的前表面侧，半导体激光元件14被树脂模制部分15的封闭部分15b包围，并且树脂模制部分15具有用作激光束发射窗口15a的开放前部。 在框架12的背面侧设置有由树脂模制部分15的U形外壳部分15d以及框架12暴露于外部的暴露部分16e包围的暴露部分16e。
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公开(公告)号：US20060285476A1
公开(公告)日：2006-12-21
申请号：US10575680
申请日：2004-10-12
IPC分类号： G11B7/00
CPC分类号： H01S5/4031 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/30107 , H01S5/02208 , H01S5/02244 , H01S5/02469 , H01S5/4087 , H01L2924/00014 , H01L2924/00
摘要： A two-beam semiconductor laser device 10 includes: a two-beam semiconductor element LDC having a first and a second semiconductor laser elements LD1 and LD2 that can be driven independently and that are formed integrally on a substrate; and a submount 63 having, mounted on a front part thereof, the two-beam semiconductor laser element LDC with the light-emitting face thereof directed forward and having a first and a second electrode pads 64 and 65 connected to electrodes 61 and 62 of the first and second semiconductor laser element LD1 and LD2 by being kept in contact therewith. The first and second electrode pads 64 and 65 are formed to extend farther behind the two-beam semiconductor laser element LDC, and wires 14 and 16 are wire-bonded behind the two-beam semiconductor laser element LDC.
摘要翻译： 双光束半导体激光器装置10包括：具有第一和第二半导体激光元件LD1和LD2的双光束半导体元件LDC，该第一和第二半导体激光元件LD1和LD2可独立驱动并且一体地形成在基板上; 以及安装在其前部的双光束半导体激光元件LDC的基座63，其中发光面向前指向并具有连接到电极61和62的第一和第二电极焊盘64和65 第一和第二半导体激光元件LD1和LD2与其保持接触。 第一和第二电极焊盘64和65形成为在双光束半导体激光元件LDC之后延伸得更远，并且导线14和16被引线键合在双光束半导体激光元件LDC的后面。
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