Method of copper plating
    3.
    发明授权
    Method of copper plating 失效
    铜镀层方法

    公开(公告)号:US5143593A

    公开(公告)日:1992-09-01

    申请号:US716870

    申请日:1991-06-18

    CPC分类号: C25D3/38 H05K3/241 Y10S205/92

    摘要: A method of copper-plating a material whereby electrolysis is performed using an electrolytic plating cell including a diaphragm which separates an anode chamber having therein an insoluble metal electrode as an anode from a cathode chamber having therein the material to be plated as a cathode, and further using an electrolyte solution containing copper ions and an additive, wherein the electrolyte is fed to the cathode chamber in a manner such that the copper ion concentration in the electrolyte within the cathode chamber is kept constant and electrolyte is further fed to the anode chamber at a rate of from about 0.2 to 11 ml/KAh.