公开(公告)号：US06831528B2

公开(公告)日：2004-12-14

申请号：US10026459

申请日：2001-12-27

申请人： Yasushi Nagata ,  Tomoyuki Iwasaki ,  Yuki Sato ,  Mitsuru Miyake ,  Takeo Yasuho

发明人： Yasushi Nagata ,  Tomoyuki Iwasaki ,  Yuki Sato ,  Mitsuru Miyake ,  Takeo Yasuho

IPC分类号： H01P110

CPC分类号： H03K17/76 ,  H01L23/49822 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01P1/15 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/09381 ,  Y02P70/613 ,  H01L2924/00

摘要： In a high-frequency switching module for use mainly in a communications apparatus and a high-frequency apparatus equipped with the same, the high-frequency switching module has a group of high-frequency terminals provided on the mounting side surface of a multi-layer assembly of which the lateral sides are formed as no-electrode provided sides excluding the high-frequency terminals. Thus, the high-frequency switching module and the high-frequency apparatus equipped with the same are less susceptible to the external effect.

摘要翻译： 在主要用于通信装置的高频开关模块和配备有该高频装置的高频装置中，高频开关模块具有设置在多层的安装侧表面上的一组高频端子 其侧面形成为不包括高频端子的无电极提供侧的组装。 因此，高频开关模块和配备有高频开关模块的高频装置不易受到外部影响。