公开(公告)号：US06780091B2

公开(公告)日：2004-08-24

申请号：US10217608

申请日：2002-08-14

申请人： Yasutaka Mizomoto ,  Satoshi Yamanaka ,  Yoshisato Doi ,  Takashi Mori ,  Takashi Kouda

发明人： Yasutaka Mizomoto ,  Satoshi Yamanaka ,  Yoshisato Doi ,  Takashi Mori ,  Takashi Kouda

IPC分类号： B24B700

CPC分类号： B24B37/345 ,  B24B53/017

摘要： A machining strain removal apparatus for removing machining strain present on a treated surface of a workpiece, for example, a ground back of a semiconductor wafer by polishing the treated surface or ground back with a polishing tool with a high efficiency in a high quality. The apparatus includes a chuck for holding the workpiece while exposing the treated surface, and a polishing component for polishing the treated surface of the workpiece held on the chuck. The polishing component includes a polishing tool, and presses the polishing tool being rotated against the treated surface of the workpiece, thereby polishing the treated surface.

摘要翻译： 一种加工应变消除装置，用于通过以高质量的高效率抛光处理的表面或用抛光工具抛光回去存在于工件的处理表面上的加工应变，例如半导体晶片的背面。 该装置包括用于在暴露经处理的表面的同时保持工件的卡盘和用于抛光保持在卡盘上的被处理表面的抛光部件。 抛光部件包括抛光工具，并且将抛光工具按压在被处理表面上的抛光工具，从而抛光经处理的表面。