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公开(公告)号：US5750637A
公开(公告)日：1998-05-12
申请号：US658166
申请日：1996-06-04
CPC分类号： C08G73/00 , C08G18/025
摘要： This invention provides a process for the preparation of a polycarbodiimide solution wherein the polycarbodiimide is synthesized by heating an organic diisocyanate (e.g., 2,4-tolylene diisocyanate or 2,6-tolylene diisocyanate) in the presence of a carbodiimidation catlayst characterized in that a non-chlorinated aromatic hydrocarbon is used as the solvent and the resulting polycarbodiimide has a number average molecular weight from about 3,000 to about 10,000; wherein the synthesis is performed in the temperature range of from about 100.degree. to about 120.degree. C.
摘要翻译： 本发明提供一种制备聚碳二亚胺溶液的方法，其中聚碳二亚胺通过在碳二亚胺二酰亚胺存在下加热有机二异氰酸酯（例如，2,4-甲苯二异氰酸酯或2,6-甲苯二异氰酸酯）来合成，其特征在于， 使用非氯化芳烃作为溶剂，所得聚碳二亚胺的数均分子量为约3,000至约10,000; 其中合成在约100℃至约120℃的温度范围内进行。
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2.发明授权Process for the preparation of a high-molecular-weight polycarbodiimide solution 失效制备高分子量聚碳二亚胺溶液的方法
公开(公告)号：US5750636A
公开(公告)日：1998-05-12
申请号：US658165
申请日：1996-06-04
CPC分类号： C08G73/00 , C08G18/025
摘要： This invention provides a process wherein a stable solution of polycarbodiimide with a number-average molecular-weight of 5,000 to 60,000 can be very easily prepared by using an organic diisocyanate (e.g., 2,4-tolylene diisocyanate or 2,6-tolylene diisocyanate) as starting material, a cyclic phosphine oxide as catalyst and a chlorinated aromatic compound as solvent and by controlling certain reaction conditions within the reaction temperature range of 110.degree. to 150.degree. C.
摘要翻译： 本发明提供一种方法，其中通过使用有机二异氰酸酯（例如，2,4-甲苯二异氰酸酯或2,6-甲苯二异氰酸酯）可以非常容易地制备数均分子量为5,000至60,000的聚碳化二亚胺的稳定溶液， 作为起始原料，作为催化剂的环状氧化膦和氯化芳族化合物作为溶剂，并通过在110℃至150℃的反应温度范围内控制某些反应条件。
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公开(公告)号：US5821325A
公开(公告)日：1998-10-13
申请号：US763982
申请日：1996-12-10
CPC分类号： C08G18/025
摘要： A hydroxy- or mercapto-bearing organic compound is caused to react with a polycarbodiimide compound in the presence of an alcoholate of an alkali metal or of an alkaline earth metal. The carbodiimide linkage in the polymer which results from the above-described reaction is crosslinked.
摘要翻译： 使含羟基或巯基的有机化合物在碱金属或碱土金属的醇化物的存在下与聚碳化二亚胺化合物反应。 由上述反应得到的聚合物中的碳二亚胺键被交联。
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公开(公告)号：US5837801A
公开(公告)日：1998-11-17
申请号：US759381
申请日：1996-12-04
IPC分类号： C04B35/524 , C08G18/02 , C08G73/10 , C08G95/04
CPC分类号： C08G18/025 , C04B35/524
摘要： The method for preparing a crosslinked polycarbodiimide according to the present invention comprises reacting a polydicarbodiimide compound with a compound, which has in a molecule thereof two or more hydroxy or mercapto groups, in the presence of an alcoholate of an alkali metal or of an alkaline earth metal. The crosslinked polycarbodiimide obtained according to the method is excellent in heat resistance and mechanical properties.
摘要翻译： 根据本发明的制备交联聚碳化二亚胺的方法包括在碱金属或碱土金属的醇盐存在下使聚二碳酰亚胺化合物与分子中具有两个或多个羟基或巯基的化合物 金属。 根据该方法得到的交联聚碳化二亚胺具有优异的耐热性和机械性能。
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公开(公告)号：US5770661A
公开(公告)日：1998-06-23
申请号：US785170
申请日：1997-01-13
CPC分类号： C08G73/00 , C08G73/065
摘要： A polycarbodiimide compound is reacted with an organic compound having at least two amino groups in the molecule. A polycarbodiimide compound is reacted with an amine compound having a silicon atom in the molecule. The carbodiimide bonds remained in the crosslinked material are further crosslinked. The crosslinked material is further heated/calcined to obtain an inorganic material having high heat resistance and strong toughness.
摘要翻译： 聚碳二亚胺化合物与分子中具有至少两个氨基的有机化合物反应。 聚碳二亚胺化合物与分子中具有硅原子的胺化合物反应。 保留在交联材料中的碳二亚胺键进一步交联。 将交联材料进一步加热/煅烧，得到耐热性高，韧性强的无机材料。
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6.发明授权Polycarbodiimide resin-containing adhesive and flexible printed circuit board 失效含聚碳酰亚胺树脂的粘合剂和柔性印刷电路板
公开(公告)号：US5916675A
公开(公告)日：1999-06-29
申请号：US873947
申请日：1997-06-12
申请人： Yasuyoshi Komoto , Akira Hayashida , Michio Aizawa , Hitoshi Arai , Ken Yahata
发明人： Yasuyoshi Komoto , Akira Hayashida , Michio Aizawa , Hitoshi Arai , Ken Yahata
CPC分类号： H05K3/386 , B32B15/08 , C08G73/00 , C08G73/06 , H05K1/0393 , H05K2201/0154 , H05K2201/0355 , Y10T428/2852 , Y10T428/2861 , Y10T428/2896 , Y10T428/31551 , Y10T428/31605
摘要： Described is an adhesive containing a polycarbodiimide resin having repeating units represented by the following formula:.paren open-st.R--N.dbd.C.dbd.N.paren close-st..sub.nwherein R is a divalent hydrocarbon group and n is an integer of 5 to 250, and also described is a flexible printed circuit board and a coverlay film fabricated using the above-described polycarbodiimide resin-containing adhesive.
摘要翻译： 描述了含有具有由下式表示的重复单元的聚碳化二亚胺树脂的粘合剂：+545RN = C = N + 546 n其中R是二价烃基，n是5至250的整数，并且还描述了柔性印刷 电路板和使用上述含聚碳酰亚胺树脂的粘合剂制成的覆盖膜。
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7.发明授权Polycarbodiimide resin-containing adhesive and flexible printed circuit board 失效含聚碳酰亚胺树脂的粘合剂和柔性印刷电路板
公开(公告)号：US6143409A
公开(公告)日：2000-11-07
申请号：US199366
申请日：1998-11-25
申请人： Yasuyoshi Komoto , Akira Hayashida , Michio Aizawa , Hitoshi Arai , Ken Yahata
发明人： Yasuyoshi Komoto , Akira Hayashida , Michio Aizawa , Hitoshi Arai , Ken Yahata
CPC分类号： C08G73/00 , B32B15/08 , B32B7/12 , H05K1/0393 , H05K2201/0154 , H05K2201/0355 , Y10T428/2852 , Y10T428/2861 , Y10T428/2896
摘要： Described is an adhesive containing a polycarbodiimide resin having repeating units represented by the following formula:.paren open-st.R--N.dbd.C.dbd.N.paren close-st..sub.nwherein R is a divalent hydrocarbon group and n is an integer of 5 to 250, and also described is a flexible printed circuit board and a coverlay film fabricated using the above-described polycarbodiimide resin-containing adhesive.
摘要翻译： 描述了含有具有由下式表示的重复单元的聚碳二亚胺树脂的粘合剂：+545NR = C = N + 546n其中R是二价烃基，n是5至250的整数，并且还描述了一种柔性 印刷电路板和使用上述含聚碳酰亚胺树脂的粘合剂制造的覆盖膜。
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