公开(公告)号：US10236596B2

公开(公告)日：2019-03-19

申请号：US16024629

申请日：2018-06-29

申请人： Yazaki Corporation ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Takayoshi Hirakawa ,  Yasuhiro Tanaka ,  Kengo Machida ,  Akio Kitami ,  Kenshi Yamanaka

IPC分类号： H01R11/22 ,  H01R13/187 ,  H01R4/48 ,  H01R4/18 ,  H01R4/60

摘要： A connection terminal includes a terminal main body, a contact member, a locking structure, and a position adjustment structure. The terminal main body is electrically conductive and includes a female connector. The contact member is disposed, in a first region of an internal space of the female connector, to face an inner circumferential surface of the female connector. The locking structure holds the contact member at a position thereof after completion of housing of the contact member in the internal space. The position adjustment structure adjusts the position of the contact member in the internal space. The position adjustment structure includes a locked holder disposed in the contact member and a locking holder disposed in the terminal main body.

公开(公告)号：US20190006773A1

公开(公告)日：2019-01-03

申请号：US16024629

申请日：2018-06-29

申请人： Yazaki Corporation ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Takayoshi Hirakawa ,  Yasuhiro Tanaka ,  Kengo Machida ,  Akio Kitami ,  Kenshi Yamanaka

IPC分类号： H01R4/48 ,  H01R4/60 ,  H01R4/18

摘要： A connection terminal includes a terminal main body, a contact member, a locking structure, and a position adjustment structure. The terminal main body is electrically conductive and includes a female connector. The contact member is disposed, in a first region of an internal space of the female connector, to face an inner circumferential surface of the female connector. The locking structure holds the contact member at a position thereof after completion of housing of the contact member in the internal space. The position adjustment structure adjusts the position of the contact member in the internal space. The position adjustment structure includes a locked holder disposed in the contact member and a locking holder disposed in the terminal main body.

公开(公告)号：US09768095B2

公开(公告)日：2017-09-19

申请号：US15361151

申请日：2016-11-25

申请人： NIPPON SOKEN, INC. ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Tomo Sasaki ,  Akio Kitami ,  Tadafumi Yoshida ,  Masataka Deguchi ,  Kazunori Uchiyama ,  Naoki Hakamada

IPC分类号： H01L23/373 ,  H01L23/42 ,  H01L23/473

CPC分类号： H01L23/3736 ,  H01L23/4012 ,  H01L23/42 ,  H01L23/473 ,  H01L25/117 ,  H01L2224/40245 ,  H01L2924/181 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor module. The semiconductor module includes a package made of resin. The package contains a semiconductor element and a heat sink. The heat sink has a thermal conductive surface exposed on a part of one surface of the package. The semiconductor device includes an insulating plate, which is a part of a cooler, facing the thermal conductive surface of the heat sink and a resin surface around the thermal conductive surface, and pressed against the semiconductor module. At least a part of the thermal conductive surface comprises a recessed region recessed with respect to the resin surface. A solid heat transfer layer is interposed between the recessed region of the thermal conductive surface and the insulating plate, and is not interposed between the resin surface and the insulating plate.