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公开(公告)号：US20100277850A1
公开(公告)日：2010-11-04
申请号：US12433680
申请日：2009-04-30
Applicant: Yi-Pin Chang , Tung Long Lai , Soon Kang Huang
Inventor： Yi-Pin Chang , Tung Long Lai , Soon Kang Huang
IPC: H01L21/683 , H01L21/66 , B05C11/00 , C23F1/08
CPC classification number: H01L21/67288 , H01L21/6831
Abstract: A method for processing a semiconductor wafer comprises measuring data indicating an amount of warpage of the wafer. At least two different voltages are determined, based on the amount of warpage. The voltages are to be applied to respective portions of the wafer by an electrostatic chuck that is to hold the wafer. The at least two different voltages are applied to hold the respective portions of the wafer while performing a fabrication process on the wafer.
Abstract translation: 用于处理半导体晶片的方法包括测量表示晶片的翘曲量的数据。 基于翘曲量确定至少两个不同的电压。 通过用于保持晶片的静电卡盘将电压施加到晶片的相应部分。 施加至少两个不同的电压以在晶片上执行制造工艺时保持晶片的各个部分。
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公开(公告)号：US08623141B2
公开(公告)日：2014-01-07
申请号：US12467375
申请日：2009-05-18
Applicant: Yi-Pin Chang , Chyi Shyuan Chern
Inventor： Yi-Pin Chang , Chyi Shyuan Chern
CPC classification number: F16K51/02 , Y10T137/0379 , Y10T137/86002 , Y10T137/86027 , Y10T137/86083 , Y10T137/87684
Abstract: A vacuum system for semiconductor fabrication. The system includes a vacuum chamber for performing a semiconductor fabrication process, a vacuum source, and a piping system fluidly connecting the vacuum chamber to the vacuum source. In one embodiment, the piping system is configured without a horizontal flow path section of piping. In some embodiments, the piping system includes a first piping branch and a second piping branch. The first and second piping branches preferably have a symmetrical configuration with respect to the vacuum source. In yet other embodiments, the first and second piping branches preferably each include a throttle valve.
Abstract translation: 一种用于半导体制造的真空系统。 该系统包括用于执行半导体制造工艺的真空室，真空源和将真空室流体连接到真空源的管道系统。 在一个实施例中，管道系统被配置为没有管道的水平流动路径部分。 在一些实施例中，管道系统包括第一管道分支和第二管道分支。 第一和第二管道分支优选地具有相对于真空源的对称构造。 在其他实施例中，第一和第二管道分支优选地各自包括节流阀。
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公开(公告)号：US07957118B2
公开(公告)日：2011-06-07
申请号：US12433680
申请日：2009-04-30
Applicant: Yi-Pin Chang , Tung Long Lai , Soon Kang Huang
Inventor： Yi-Pin Chang , Tung Long Lai , Soon Kang Huang
IPC: H01L21/683 , H01T23/00
CPC classification number: H01L21/67288 , H01L21/6831
Abstract: A method for processing a semiconductor wafer comprises measuring data indicating an amount of warpage of the wafer. At least two different voltages are determined, based on the amount of warpage. The voltages are to be applied to respective portions of the wafer by an electrostatic chuck that is to hold the wafer. The at least two different voltages are applied to hold the respective portions of the wafer while performing a fabrication process on the wafer.
Abstract translation: 用于处理半导体晶片的方法包括测量表示晶片的翘曲量的数据。 基于翘曲量确定至少两个不同的电压。 通过用于保持晶片的静电卡盘将电压施加到晶片的相应部分。 施加至少两个不同的电压以在晶片上执行制造工艺时保持晶片的各个部分。
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公开(公告)号：US20060022995A1
公开(公告)日：2006-02-02
申请号：US10903580
申请日：2004-07-30
Applicant: Yi-Pin Chang
Inventor： Yi-Pin Chang
IPC: G09G5/02
CPC classification number: G06T5/002 , G06T5/20 , G06T2207/10024
Abstract: A method for cleaning the noise in an image obtains an image having an interested pixel and a predetermined number of neighboring pixels for each of red, green and blue, then calculates an adjusted value for the interested pixel based on the existing value of the interested pixel and the values of the predetermined number of neighboring pixels. This calculation is carried out for each of red, green and blue using the same predetermined number of neighboring pixels.
Abstract translation: 用于清除图像中的噪声的方法获得具有红色，绿色和蓝色中的每一个的感兴趣像素和预定数量的相邻像素的图像，然后基于感兴趣像素的现有值来计算感兴趣像素的调整值 以及预定数量的相邻像素的值。 使用相同的预定数量的相邻像素对红色，绿色和蓝色中的每一个进行该计算。
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