公开(公告)号：US08072489B2

公开(公告)日：2011-12-06

申请号：US11592912

申请日：2006-11-03

Applicant: Ying-Cheng Wu ,  Ying-Tang Su

Inventor： Ying-Cheng Wu ,  Ying-Tang Su

IPC: A61B1/04 ,  H04N5/225

CPC classification number: H04N5/2253 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/16195 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

Abstract: A chip package (101) and a lens module (103) mounted on the chip package are provided. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip.

Abstract translation: 提供安装在芯片封装上的芯片封装（101）和透镜模块（103）。 芯片封装包括基板（20），第一芯片（40），第二芯片（70）和盖（80）。 第一芯片安装在基板上，并且经由第一多根导线（50a）与基板电连接。 所述第二芯片安装在所述第一芯片上方并且与所述第一芯片连接的导线上方并且经由第二多个导线（50b）与所述基板电连接。 盖被安装在第二芯片上方，并且电线与第二芯片连接。

公开(公告)号：US20070165136A1

公开(公告)日：2007-07-19

申请号：US11592912

申请日：2006-11-03

Applicant: Ying-Cheng Wu ,  Ying-Tang Su

Inventor： Ying-Cheng Wu ,  Ying-Tang Su

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/16195 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

Abstract: A digital camera module (10) includes a chip package (101) and a lens module (103) mounted on the chip package. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip.

Abstract translation: 数字照相机模块（10）包括芯片封装（101）和安装在芯片封装上的透镜模块（103）。 芯片封装包括基板（20），第一芯片（40），第二芯片（70）和盖（80）。 第一芯片安装在基板上，并通过第一多根导线（50a）与基板电连接。 第二芯片安装在第一芯片上方并且连接在与第一芯片连接的导线上方，并且经由第二多个导线（50b）与基板电连接。 盖被安装在第二芯片上方，并且电线与第二芯片连接。

公开(公告)号：US20070152345A1

公开(公告)日：2007-07-05

申请号：US11592848

申请日：2006-11-03

Applicant: Ying-Cheng Wu ,  Ying-Tang Su

Inventor： Ying-Cheng Wu ,  Ying-Tang Su

IPC: H01L23/52

CPC classification number: H01L25/0657 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48992 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/00014

Abstract: A stacked chip packaging structure (10) includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip. The mounting of the second chip and the cover in such a manner is facilitated through the use of an adhesive/glue (60a, 60b) that is able to function both as an adherent and as a spacer.

Abstract translation: 堆叠式芯片封装结构（10）包括基板（20），第一芯片（40），第二芯片（70）和盖（80）。 第一芯片安装在基板上，并通过第一多根导线（50a）与基板电连接。 第二芯片安装在第一芯片上方并且连接在与第一芯片连接的导线上方，并且经由第二多个导线（50b）与基板电连接。 盖被安装在第二芯片上方，并且电线与第二芯片连接。 通过使用能够既作为粘着剂又作为隔离物使用的粘合剂/胶（60a，60b），可以有利于以这种方式安装第二芯片和盖。

公开(公告)号：US07374431B2

公开(公告)日：2008-05-20

申请号：US11472966

申请日：2006-06-21

Applicant: Ying-Tang Su

Inventor： Ying-Tang Su

IPC: H01R12/00

CPC classification number: H04N5/2254 ,  H04N5/2257

Abstract: A clamping device (100) for clamping a digital camera module (300) includes a base (12) and two legs (14). Two legs extend from two sides of the base. Each leg has at least one foot (18). The at least one foot defines an arcuate surface (180). The arcuate surfaces cooperatively define a space for receiving the digital camera module.

Abstract translation: 用于夹紧数字照相机模块（300）的夹紧装置（100）包括基部（12）和两个腿部（14）。 两条腿从底座的两侧延伸。 每条腿至少有一只脚（18）。 所述至少一个脚限定弓形表面（180）。 弧形表面协同地限定用于接收数字照相机模块的空间。

公开(公告)号：US20070128910A1

公开(公告)日：2007-06-07

申请号：US11472966

申请日：2006-06-21

Applicant: Ying-Tang Su

Inventor： Ying-Tang Su

IPC: H01R29/00

CPC classification number: H04N5/2254 ,  H04N5/2257

Abstract: A clamping device (100) for clamping a digital camera module (300) includes a base (12) and two legs (14). Two legs extend from two sides of the base. Each leg has at least one foot (18). The at least one foot defines an arcuate surface (180). The arcuate surfaces cooperatively define a space for receiving the digital camera module.

Abstract translation: 用于夹紧数字照相机模块（300）的夹紧装置（100）包括基部（12）和两个腿部（14）。 两条腿从底座的两侧延伸。 每条腿至少有一只脚（18）。 所述至少一个脚限定弓形表面（180）。 弧形表面协同地限定用于接收数字照相机模块的空间。