公开(公告)号：US20120194214A1

公开(公告)日：2012-08-02

申请号：US13362458

申请日：2012-01-31

申请人： Yo-se EUM ,  Dong-Chul Han ,  Yong-Ki Kim ,  Sang-Geun Kim ,  Ju-Li Kang

发明人： Yo-se EUM ,  Dong-Chul Han ,  Yong-Ki Kim ,  Sang-Geun Kim ,  Ju-Li Kang

IPC分类号： G01R31/26

CPC分类号： G01R31/2894

摘要： An equipment and method to classify semiconductor packages diced on a substrate into defective and non-defective semiconductor packages includes a loading preparation table to receive a plurality of semiconductor packages to be inspected, a first inspection unit to inspect and classify the semiconductor packages received at the loading preparation table into normal semiconductor packages and defective semiconductor packages, a temporary loading table to temporarily receive at least a portion of the normal semiconductor packages, a first loading picker to transfer the defective semiconductor packages from the loading preparation table to a defective package loading tray and to transfer the normal semiconductor packages from the temporary loading table to the loading preparation table, and a second loading picker to transfer the normal semiconductor packages from the loading preparation table to a normal package loading tray.

摘要翻译： 将在衬底上切割成有缺陷和无缺陷的半导体封装的半导体封装分类的设备和方法包括：用于接收待检查的多个半导体封装的装载准备工作台;第一检查单元，用于检查和分类在 将准备工作台装载到正常的半导体封装和有缺陷的半导体封装中，临时装载台临时接收正常的半导体封装的至少一部分;第一装载拾取器，用于将有缺陷的半导体封装从装载准备工作台转移到有缺陷的封装装载盘 并将正常的半导体封装从临时装载台传送到装载准备台;以及第二装载拾取器，用于将正常的半导体封装从装载准备台传送到正常的封装装载盘。