公开(公告)号：US20210299966A1

公开(公告)日：2021-09-30

申请号：US17215188

申请日：2021-03-29

申请人： Yoichi ITO ,  Tsuyoshi ARAO ,  Yoichi SAKURAI ,  Tomomi AKIEDA

发明人： Yoichi ITO ,  Tsuyoshi ARAO ,  Yoichi SAKURAI ,  Tomomi AKIEDA

IPC分类号： B29C64/393 ,  B29C64/209

摘要： A droplet discharge apparatus includes a discharge head including a nozzle, a nozzle surface observation device, and processing circuitry. The discharge head including the nozzle is configured to discharge a droplet onto a discharge receiving medium formed of powder. The nozzle surface observation device is configured to observe a nozzle surface of the nozzle of the discharge head. The processing circuitry is configured to calculate an adhesion amount of attached matter to the nozzle surface based on an observation result of the nozzle surface observation device. The processing circuitry is configured to determine, based on a calculation result of the adhesion amount of the attached matter, an operation on a control target that controls at least one of a mass and a discharge speed of the droplet.

公开(公告)号：US20190255765A1

公开(公告)日：2019-08-22

申请号：US16276780

申请日：2019-02-15

申请人： Yoshinobu TAKEYAMA ,  Tsuyoshi ARAO ,  Yoichi ITO ,  Atsushi TAKAI ,  Tomomi AKIEDA

发明人： Yoshinobu TAKEYAMA ,  Tsuyoshi ARAO ,  Yoichi ITO ,  Atsushi TAKAI ,  Tomomi AKIEDA

IPC分类号： B29C64/118 ,  B29C64/209 ,  B29C64/295

摘要： A fabricating apparatus includes a heater, a discharger, and circuitry. The heater is configured to heat a first fabrication material layer formed of a fabrication material. The discharger is configured to discharge a molten fabrication material onto the first fabrication material layer heated by the heater, to stack a second fabrication material layer on the first fabrication material layer. The circuitry is configured to control a heating of the heater according to shape data so that the first fabrication material layer does not exceed a threshold temperature defined by the fabrication material when the heater heats the first fabrication material layer.

公开(公告)号：US20200164574A1

公开(公告)日：2020-05-28

申请号：US16685123

申请日：2019-11-15

申请人： Masato TSUJI ,  Yoichi ITO ,  Tsuyoshi ARAO ,  Yoshinobu TAKEYAMA ,  Yoichi KAKUTA ,  Soichi NAKAMURA

发明人： Masato TSUJI ,  Yoichi ITO ,  Tsuyoshi ARAO ,  Yoshinobu TAKEYAMA ,  Yoichi KAKUTA ,  Soichi NAKAMURA

IPC分类号： B29C64/209 ,  B29C64/245 ,  B29C64/227 ,  B29C64/295 ,  B29C64/264

摘要： A modeling device includes a discharger, a first mover, a modifier, and a second mover. The discharger is configured to discharge a melted modeling material. The first mover is configured to move the discharger and a modeling platform on which the modeling material is discharged by the discharger, relative to each other. The modifier is configured to modify a layer formed of the modeling material discharged by the discharger. The second mover is configured to move the modifier relative to the discharger. The second mover is configured to move the modifier along a movement path in which an orientation of the modifier is maintained with respect to a three-axis Cartesian coordinate system.

公开(公告)号：US20200230887A1

公开(公告)日：2020-07-23

申请号：US16736963

申请日：2020-01-08

申请人： Tsuyoshi ARAO ,  Yoichi ITO ,  Yoshinobu TAKEYAMA ,  Atsushi TAKAI ,  Shohta KOBASHIGAWA

发明人： Tsuyoshi ARAO ,  Yoichi ITO ,  Yoshinobu TAKEYAMA ,  Atsushi TAKAI ,  Shohta KOBASHIGAWA

IPC分类号： B29C64/393 ,  B33Y50/02

摘要： A fabricating apparatus includes a temperature measuring device, a heating device, and circuitry. The temperature measuring device is configured to measure a temperature of a fabrication material layer. The heating device is configured to heat the fabrication material layer. The circuitry is configured to control the heating device with a heating amount for heating the fabricating material layer to a temperature at which the fabricating material layer melts, based on the temperature measured by the temperature measuring device.