公开(公告)号：US20080127011A1

公开(公告)日：2008-05-29

申请号：US11855681

申请日：2007-09-14

Applicant: Yoko KOBAYASHI ,  Hidehisa Sakai ,  Yoshiteru Ochi

Inventor： Yoko KOBAYASHI ,  Hidehisa Sakai ,  Yoshiteru Ochi

IPC: G06F17/50 ,  G06F19/00

CPC classification number: G06F17/5018 ,  G06F2217/40

Abstract: When reliability evaluation of the whole electronic package is performed, the time required for simulation is decreased, while solder connection parts, in particular, are accurately analyzed. The whole analysis model creating unit creates a solder connection part model which has the same volume, height, and connection area as the volume, height, and connection area of the solder connection part. By means of dividing the solder connection model into multiple meshes, the first mesh data for use in electronic package analysis is created.

Abstract translation: 当执行整个电子封装的可靠性评估时，模拟所需的时间减少，特别是焊接连接部分被精确地分析。 整个分析模型创建单元产生与焊料连接部分的体积，高度和连接面积相同的体积，高度和连接面积的焊料连接部分模型。 通过将焊接连接模型划分为多个网格，创建用于电子包装分析的第一个网格数据。

公开(公告)号：US20090164146A1

公开(公告)日：2009-06-25

申请号：US12331946

申请日：2008-12-10

Applicant: Yoko KOBAYASHI

Inventor： Yoko KOBAYASHI

IPC: G06F19/00

CPC classification number: H05K3/3494 ,  G01N2203/0067 ,  H01L24/17 ,  H05K2203/304

Abstract: According to an aspect of an embodiment of the present invention, a reflow process evaluation device includes, a stress calculation part for calculating an average principal stress acting on a joint portion, wherein a principal stress occurs when a chip and a substrate are joined by solder with a reflow method and a rupture occurrence ratio computation part for computing an occurrence ratio at which the joint portion ruptures based on a relational expression between the occurrence ratio and the average principal stress acting on the joint portion and the average principal stress calculated by the stress calculation part.

Abstract translation: 根据本发明的实施方式，回流处理评价装置包括：应力计算部，其计算作用于接合部的平均主应力，其中当芯片和基板通过焊料接合时发生主应力 回流法和断裂发生率计算部分，用于计算基于作用在接头部分上的发生率和平均主应力之间的关系表达式以及由应力计算的平均主应力的关系部分破裂的发生率 计算部分。