公开(公告)号：US20130140961A1

公开(公告)日：2013-06-06

申请号：US13616754

申请日：2012-09-14

申请人： Yong Sik KIM ,  Il Oung Park ,  Ho Hyung Jang

发明人： Yong Sik KIM ,  Il Oung Park ,  Ho Hyung Jang

IPC分类号： H02K19/02 ,  H02K15/00

CPC分类号： H02K5/1675 ,  H02K15/14

摘要： There is provided a spindle motor including: a sleeve rotatably supporting a shaft; a cover member installed on a lower end portion of the sleeve; and a bonding member disposed between the sleeve and the cover member such that the cover member is installed on the sleeve and formed of an anisotropic conductive material.

摘要翻译： 提供了一种主轴电动机，其包括：可旋转地支撑轴的套筒; 安装在所述套筒的下端部的盖部件; 以及设置在套筒和盖构件之间的接合构件，使得盖构件安装在套筒上并由各向异性导电材料形成。

公开(公告)号：US20070246728A1

公开(公告)日：2007-10-25

申请号：US11736159

申请日：2007-04-17

申请人： Yong Sik KIM ,  Seog Moon CHOI ,  Hyun Ho KIM

发明人： Yong Sik KIM ,  Seog Moon CHOI ,  Hyun Ho KIM

IPC分类号： H01L33/00

CPC分类号： H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/0091 ,  H01L2924/00014

摘要： A surface mounting device-type light emitting diode (SMD-type LED) comprises a lead frame composed of a pair of lead terminals; a package housing a portion of the lead frame therein, the package having an emission window which is opened so that light is emitted through the emission window; an LED chip mounted on the lead frame inside the package; a wire for electrically connecting the LED chip and the lead frame; and a molding material filled in the package, the molding material having surface irregularities with a predetermined shape formed on the surface thereof which is exposed through the emission window of the package.

摘要翻译： 表面安装器件型发光二极管（SMD型LED）包括由一对引线端子构成的引线框架; 一个将引线框架的一部分容纳在其中的封装，该封装具有一个打开的发射窗，使得光通过发射窗口发射; LED芯片安装在封装内的引线框架上; 用于电连接LED芯片和引线框架的导线; 以及填充在所述封装中的成型材料，所述成型材料具有形成在其表面上的具有预定形状的表面凹凸，所述表面凹凸通过所述封装的所述发射窗露出。