公开(公告)号：US20060042393A1

公开(公告)日：2006-03-02

申请号：US10928024

申请日：2004-08-27

申请人： Yoshikazu Kaneko ,  Shuji Shimada ,  Ikuhiro Yanagisawa ,  Yoshinori Wada ,  William Kosh ,  William Loxsom

发明人： Yoshikazu Kaneko ,  Shuji Shimada ,  Ikuhiro Yanagisawa ,  Yoshinori Wada ,  William Kosh ,  William Loxsom

IPC分类号： G01L9/00

CPC分类号： G01L19/148 ,  G01L9/0055 ,  G01L19/143

摘要： A pressure measurement system may provide ready manufacturing, reliable operation, and/or enhanced performance by using a circuit board housing. In particular implementations, a pressure measurement system includes a pressure inlet joint, a pressure detecting component, a circuit board, and a circuit board housing. The pressure detecting component is coupled to the pressure inlet joint, which is adapted to introduce a pressure of a fluid. The circuit board is coupled to the pressure detecting component and is operable to condition an electrical signal from the pressure detecting component. The circuit board housing at least partially encloses the pressure detecting component and is adapted to engage the circuit board. The circuit board housing has a substantially cylindrical shape and includes a larger diameter section and a smaller diameter section, the smaller diameter section coupled to the pressure inlet joint, the circuit board located at least in part in the larger diameter section.

摘要翻译： 压力测量系统可以通过使用电路板外壳来提供准备制造，可靠的操作和/或增强的性能。 在具体实施方式中，压力测量系统包括压力入口接头，压力检测部件，电路板和电路板外壳。 压力检测部件联接到压力入口接头，其适于引入流体的压力。 电路板耦合到压力检测部件并且可操作以调节来自压力检测部件的电信号。 电路板壳体至少部分地包围压力检测部件并且适于接合电路板。 电路板壳体具有大致圆柱形形状，并且包括较大直径部分和较小直径部分，较小直径部分联接到压力入口接头，电路板至少部分地位于较大直径部分中。

公开(公告)号：US07270010B2

公开(公告)日：2007-09-18

申请号：US10928024

申请日：2004-08-27

申请人： Yoshikazu Kaneko ,  Shuji Shimada ,  Ikuhiro Yanagisawa ,  Yoshinori Wada ,  William Stephen Kosh ,  William J. Loxsom

发明人： Yoshikazu Kaneko ,  Shuji Shimada ,  Ikuhiro Yanagisawa ,  Yoshinori Wada ,  William Stephen Kosh ,  William J. Loxsom

IPC分类号： G01L9/00

CPC分类号： G01L19/148 ,  G01L9/0055 ,  G01L19/143

摘要： A pressure measurement system may provide ready manufacturing, reliable operation, and/or enhanced performance by using a circuit board housing. In particular implementations, a pressure measurement system includes a pressure inlet joint, a pressure detecting component, a circuit board, and a circuit board housing. The pressure detecting component is coupled to the pressure inlet joint, which is adapted to introduce a pressure of a fluid. The circuit board is coupled to the pressure detecting component and is operable to condition an electrical signal from the pressure detecting component. The circuit board housing at least partially encloses the pressure detecting component and is adapted to engage the circuit board. The circuit board housing has a substantially cylindrical shape and includes a larger diameter section and a smaller diameter section, the smaller diameter section coupled to the pressure inlet joint, the circuit board located at least in part in the larger diameter section.

摘要翻译： 压力测量系统可以通过使用电路板外壳来提供准备制造，可靠的操作和/或增强的性能。 在具体实施方式中，压力测量系统包括压力入口接头，压力检测部件，电路板和电路板外壳。 压力检测部件联接到压力入口接头，其适于引入流体的压力。 电路板耦合到压力检测部件并且可操作以调节来自压力检测部件的电信号。 电路板壳体至少部分地包围压力检测部件并且适于接合电路板。 电路板壳体具有大致圆柱形形状，并且包括较大直径部分和较小直径部分，较小直径部分联接到压力入口接头，电路板至少部分地位于较大直径部分中。