公开(公告)号：US5660708A

公开(公告)日：1997-08-26

申请号：US561329

申请日：1995-11-21

申请人： Yoshimaro Tezuka ,  Katsuhisa Tokunaga ,  Mitsuyuki Kakimoto ,  Shigeki Ogawa ,  Miyuki Tani ,  Satoshi Kobayashi ,  Kiyotaka Sasaki ,  Motoyuki Tomizawa

发明人： Yoshimaro Tezuka ,  Katsuhisa Tokunaga ,  Mitsuyuki Kakimoto ,  Shigeki Ogawa ,  Miyuki Tani ,  Satoshi Kobayashi ,  Kiyotaka Sasaki ,  Motoyuki Tomizawa

IPC分类号： C25D5/34 ,  C25F3/16 ,  C25F7/00 ,  H01L21/48 ,  H01L23/495 ,  B05D3/00

CPC分类号： C25F7/00 ,  C25D5/34 ,  C25F3/16 ,  H01L21/4821 ,  H01L23/49582 ,  H01L2924/0002

摘要： It is an object of this invention to provide a process for manufacturing a lead frame by polishing a blank for a lead frame electrolytically and plating the electrolytically polished surface of the blank with a metal, which process enables the electrolytic polishing of the blank to be continued for a long time by employing a contactless electrolytic polishing apparatus, and can form an electrolytically polished surface which is sufficiently smooth to allow it to be plated with a very good metal coating.The contactless electrolytic polishing apparatus is employed for applying a direct current with ripples having a frequency of 40 to 120 Hz alternately to the anode and cathode in an electrolytic polishing tank filled with an electrolytic polishing solution, so that the time for which the blank positioned between both electrodes functions as the anode may be at least 3.3 times longer than that for which it functions as the cathode, and the blank is, then, plated with a metal by employing a customary method.

摘要翻译： 本发明的一个目的是提供一种用于通过用电解抛光引线框架的坯料并用金属电镀该电解抛光表面来制造引线框架的方法，该方法能够使坯料的电解抛光继续 通过使用非接触式电解抛光装置长时间地形成电解抛光表面，该表面足够光滑以使其能够镀有非常好的金属涂层。 非接触电解抛光装置用于在填充有电解抛光溶液的电解抛光槽中向阳极和阴极交替施加具有40至120Hz频率的波纹的直流电流，使得坯料位于 两个电极用作阳极可能比其用作阴极的电极的时间长至少3.3倍，然后通过采用常规方法将电镀金属。

公开(公告)号：US5843290A

公开(公告)日：1998-12-01

申请号：US792224

申请日：1997-01-31

申请人： Yoshimaro Tezuka ,  Katsuhisa Tokunaga ,  Mitsuyuki Kakimoto ,  Shigeki Ogawa ,  Miyuki Tani ,  Satoshi Kobayashi ,  Kiyotaka Sasaki ,  Motoyuki Tomizawa

发明人： Yoshimaro Tezuka ,  Katsuhisa Tokunaga ,  Mitsuyuki Kakimoto ,  Shigeki Ogawa ,  Miyuki Tani ,  Satoshi Kobayashi ,  Kiyotaka Sasaki ,  Motoyuki Tomizawa

IPC分类号： C25D5/34 ,  C25F3/16 ,  C25F7/00 ,  H01L21/48 ,  H01L23/495

CPC分类号： C25F7/00 ,  C25D5/34 ,  C25F3/16 ,  H01L21/4821 ,  H01L23/49582 ,  H01L2924/0002

摘要： A contactless electrolytic polishing apparatus for manufacturing a lead frame having a smooth polished surface includes a polishing tank containing polishing solution and divided by partitions into a first cathode-containing vessel, a first solution-discharge vessel, a first anode-containing vessel, a second solution-discharge vessel, a second anode-containing vessel, a third solution-discharge vessel and a second cathode-containing vessel. A direct current is applied with ripples having a frequency of 40 to 120 Hz alternately to the anode and cathode in the electrolytic polishing tank filled with an electrolytic polishing solution so that the time for which the blank positioned between both electrodes functions as the anode may be at least 3.3 times longer than that for which it functions as the cathode. The blank is then plated with a metal by employing a customary method.

摘要翻译： 一种用于制造具有光滑抛光表面的引线框架的非接触式电解抛光装置，包括：抛光槽，其包含抛光溶液，并由隔板分隔成第一阴极容纳容器，第一溶液 - 放电容器，第一含阳极容器，第二 溶液 - 放电容器，第二阳极容器，第三溶液 - 放电容器和第二阴极容器。 在电解抛光溶液的电解抛光槽中，直接电流施加频率为40〜120Hz的波纹，使得位于两电极之间的空白位置作为阳极的时间可以为 比其作为阴极的时间长至少3.3倍。 然后通过采用常规方法用金属镀该坯料。