公开(公告)号：US06239406B1

公开(公告)日：2001-05-29

申请号：US09280827

申请日：1999-03-30

申请人： Yoshimi Onoma ,  Masato Edahiro

发明人： Yoshimi Onoma ,  Masato Edahiro

IPC分类号： B23K2638

CPC分类号： H01L21/76894 ,  B23K26/0853

摘要： A laser beam machining apparatus has machining apparatus including a laser oscillator, a stage for moving a workpiece in XY directions, and a central processing unit (CPU) for controlling laser emission of the laser oscillator and movement of the stage. The CPU causes the laser beam machining apparatus to group machining points on the workpiece into a plurality of segments, each segment being a set of machining points aligned parallel to one of the X axis and Y axis, to create a shortest route through the plurality of segments, to drive the stage along the shortest route, and to apply a laser beam on the machining points on the shortest route.

摘要翻译： 激光束加工装置具有激光振荡器，XY工件移动台以及控制激光振荡器的激光发射的中央处理单元（CPU）的加工装置。 CPU使激光束加工装置将工件上的加工点分组成多个段，每个段是与X轴和Y轴之一平行排列的一组加工点，以创建通过多个 沿最短路线驱动舞台，并在最短路线的加工点上施加激光束。