公开(公告)号：US20110073469A1

公开(公告)日：2011-03-31

申请号：US12736176

申请日：2008-03-19

申请人： Yue Ma ,  Chuan He ,  Zhenxu Pang ,  Guangtao Shi ,  Jiexu Xia ,  Voha Nuch ,  Hui Wang

发明人： Yue Ma ,  Chuan He ,  Zhenxu Pang ,  Guangtao Shi ,  Jiexu Xia ,  Voha Nuch ,  Hui Wang

IPC分类号： C25D17/00

CPC分类号： H01L21/6723 ,  C25D5/48 ,  C25D5/50 ,  C25D17/00 ,  C25D17/001 ,  C25D17/02 ,  C25D17/04 ,  C25D21/02 ,  H01L21/67178

摘要： A electrochemical deposition system which has a 3-D stacked architecture comprises a factory interface for receiving semiconductor wafers, a mainframe comprising a mainframe transfer robot and a plurality of wafer holder assemblies which disposed on the top thereof, a plurality of electroplating cells disposed within the mainframe, a plurality of cleaning cells disposed within the mainframe and located below the electroplating cells, a plurality of thermal treatment chambers disposed in between the mainframe and the factory interface, and a fluid distribution system fluidly connected to the electroplating cells and the cleaning cells, wherein the mainframe transfer robot transfers the semiconductor wafer from the factory interface and within the electroplating cells, the cleaning cells, and the thermal treatment chambers. As a result, the system of the present invention is expandable to accommodate newly-added processing units without overmuch increased footprint.

摘要翻译： 具有3-D堆叠结构的电化学沉积系统包括用于接收半导体晶片的工厂接口，包括主机传送机器人的主机和设置在其顶部的多个晶片保持器组件，多个电镀单元 主机，设置在主机内并位于电镀单元下方的多个清洁单元，设置在主机和工厂界面之间的多个热处理室，以及流体连接到电镀单元和清洁单元的流体分配系统， 其中所述主机传送机器人从所述工厂接口和所述电镀单元，所述清洁单元和所述热处理室中传送所述半导体晶片。 结果，本发明的系统可扩展以容纳新增的处理单元，而不会增加占用空间。