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253 条记录 (耗时 0.02 秒)

    SYSTEMS AND METHODS FOR PREPARING AND PLATING OF WORK ROLLS
    6.
    发明申请
    SYSTEMS AND METHODS FOR PREPARING AND PLATING OF WORK ROLLS 有权
    制作和放置工作辊的系统和方法

    公开(公告)号：US20150096885A1

    公开(公告)日：2015-04-09

    申请号：US14504002

    申请日：2014-10-01

    申请人： NEO INDUSTRIES, INC.

    发明人： Michal Fedor ,  Milan Smolen

    IPC分类号： C25D17/02 ,  C25D3/04 ,  C25D21/04 ,  C25D21/02

    CPC分类号： C25D17/02 ,  C23C18/1628 ,  C23C18/163 ,  C23C18/1676 ,  C23C18/168 ,  C25D3/04 ,  C25D17/04 ,  C25D17/06 ,  C25D21/02 ,  C25D21/04

    摘要： The present embodiments are directed to systems and methods for plating of work rolls. In one embodiment, a system includes an inner tank having an inner diameter dimensioned to receive a work roll, and an outer tank, wherein the inner tank is disposed coaxially within the outer tank. The inner tank and the outer tank may each include cylindrical shapes. A temperature regulating tank, positioned outside of the outer tank, may be in fluid communication with an annular space between the inner and outer tanks. An exhaust hood having a generally ring-shaped profile including a plurality of slots formed therein may suction fumes from the inner tank. An anode configuration also is disclosed, having a shunt incorporated into the anode, wherein current going to the anode passes through the shunt.

    摘要翻译： 本实施例涉及用于电镀工作辊的系统和方法。 在一个实施例中，系统包括具有尺寸设计成容纳工作辊的内径的内部容器和外部容器，其中内部容器同轴地设置在外部容器内。 内罐和外罐可以各自包括圆柱形。 位于外罐外部的温度调节罐可以与内罐和外罐之间的环形空间流体连通。 具有包括形成在其中的多个槽的大致环形轮廓的排气罩可以从内罐吸入烟雾。 还公开了一种阳极配置，其具有并入到阳极中的分流器，其中流向阳极的电流通过分流器。

    MATERIAL SURFACE TREATMENT METHOD USING CONCURRENT ELECTRICAL AND PHOTONIC STIMULATION
    7.
    发明申请
    MATERIAL SURFACE TREATMENT METHOD USING CONCURRENT ELECTRICAL AND PHOTONIC STIMULATION 审中-公开
    使用电流和光子刺激的材料表面处理方法

    公开(公告)号：US20130233718A1

    公开(公告)日：2013-09-12

    申请号：US13874117

    申请日：2013-04-30

    申请人： Brian P. Roarty ,  Carol J. Walker

    发明人： Brian P. Roarty ,  Carol J. Walker

    IPC分类号： C25D5/00

    CPC分类号： C25D5/006 ,  B01J19/127 ,  C25B11/0405 ,  C25D5/003 ,  C25D9/04 ,  C25D21/02

    摘要： A material surface treatment protocol (e.g., FIG. 13) uses concurrent electronic and photonic stimulation to generate an exothermic reaction and coat the surface (e.g., FIGS. 8 and 9) of a material, such as palladium. This protocol is performed at or near the boiling point of water within a sealed vessel that prevents the escape of steam and that is lined with silica or a similar glass to increase the silica available to the reaction. The great majority of the applied energy is heat used to elevate the temperature to near the boiling point, while concurrent stimulations provide only about 100 mW of additional energy for the surface treatment.

    摘要翻译： 材料表面处理方案（例如，图13）使用并发的电子和光子刺激来产生放热反应并涂覆诸如钯的材料的表面（例如，图8和9）。 该方案在密封容器内或附近的水的沸点下进行，其防止蒸汽逸出，并且衬有二氧化硅或类似的玻璃以增加可用于反应的二氧化硅。 大部分应用能量是用于将温度升高到接近沸点的热量，而同时刺激仅提供约100mW的额外能量用于表面处理。

    Preparing electrodes for electroplating
    8.
    发明授权
    Preparing electrodes for electroplating 有权
    准备电极用于电镀

    公开(公告)号：US08404095B2

    公开(公告)日：2013-03-26

    申请号：US12476522

    申请日：2009-06-02

    申请人： F. Keith Perkins ,  Perry Skeath ,  Lee Johnson ,  John Peele ,  William Bassett

    发明人： F. Keith Perkins ,  Perry Skeath ,  Lee Johnson ,  John Peele ,  William Bassett

    IPC分类号： C25D5/00 ,  C25D5/54

    CPC分类号： C25D5/54 ,  C25D5/003 ,  C25D5/028 ,  C25D17/10 ,  C25D21/02 ,  C25D21/04

    摘要： A method of immersing an electrode in an electroplating solution while under vacuum, to substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. A method of electroplating an electrode in an electroplating solution including the application of a vacuum to the electrode while it is immersed in the electroplating solution to thereby substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. The electroplating liquid may be applied to only one side of the electrode (“the wet side”) in which case, sufficient time is allowed to pass for the immersion liquid to fill the microscopic through-holes, cavities or indentations in the electrode. An enhancement of this mode is to force liquid through the microscopic holes from the wet side. A highly penetrating solvent may be used as an immersion liquid. Alternatively, carbon dioxide can be used as an immersion liquid, in which case the liquid carbon dioxide may be obtained by adjusting the temperature and pressure conditions in a closed container of gaseous carbon dioxide.

    摘要翻译： 一种在真空下将电极浸入电镀溶液中的方法，以基本上从电极中的微孔，空腔或凹陷中消除空气和/或其它气体。 一种在电镀溶液中电镀电极的方法，包括在将电极浸入电镀溶液中时向电极施加真空，从而基本上从电极中的微孔，空腔或凹陷中消除空气和/或其它气体。 电镀液体仅可以施加到电极的一侧（湿侧），在这种情况下，允许足够的时间通过浸液以填充电极中的微小通孔，空腔或凹陷。 这种模式的增强是迫使液体通过来自湿侧的微孔。 可以使用高渗透性的溶剂作为浸液。 或者，可以使用二氧化碳作为浸没液体，在这种情况下，可以通过调节气态二氧化碳的密闭容器中的温度和压力条件来获得液态二氧化碳。

    Plating method and plating apparatus
    9.
    发明授权
    Plating method and plating apparatus 有权
    电镀方法和电镀装置

    公开(公告)号：US08012330B2

    公开(公告)日：2011-09-06

    申请号：US12071679

    申请日：2008-02-25

    申请人： Takashi Kawakami ,  Tsutomu Nakada

    发明人： Takashi Kawakami ,  Tsutomu Nakada

    IPC分类号： C25D5/00 ,  C25D5/02 ,  C25D7/12 ,  C25D5/20 ,  B23H11/00

    CPC分类号： C25D17/008 ,  C25D5/02 ,  C25D17/004 ,  C25D21/02 ,  Y10S134/902

    摘要： A plating method, employing a face-down manner of plating and using a resistor body between a substrate and an anode, can securely bring an entire surface to be plated of the substrate into contact with a plating solution without permitting intrusion of air bubbles to the surface to be plated. A resistor body is disposed above the anode and immersed in the plating solution, allowing the plating solution to flow along an upper surface of the resistor body from the periphery toward the center of the resistor body. Thus, a raised portion of the plating solution is created in the center of the upper surface of the resistor body. The substrate is then lowered with the surface facing downwardly so as to fill the space between the surface to be plated of the substrate and the upper surface of the resistor body with the plating solution.

    摘要翻译： 在基板和阳极之间采用正面朝下的电镀方式和使用电阻体的电镀方法可以牢固地使整个基板的镀覆表面与镀液接触而不允许气泡侵入到 待镀面 电阻体设置在阳极的上方，浸在电解液中，使得电镀液从电阻体的周边朝向电阻体的中心流动。 因此，在电阻体的上表面的中央形成电镀液的隆起部。 然后将表面朝下放置基板，以便用电镀液填充基板的被镀表面和电阻体的上表面之间的空间。

    METHOD AND APPARATUS FOR TREATING A COMPONENT OF A GAS TURBINE ENGINE
    10.
    发明申请
    METHOD AND APPARATUS FOR TREATING A COMPONENT OF A GAS TURBINE ENGINE 有权
    用于处理气体涡轮发动机的组件的方法和装置

    公开(公告)号：US20080169204A1

    公开(公告)日：2008-07-17

    申请号：US11873480

    申请日：2007-10-17

    申请人： Daniel Clark ,  Stephen Tuppen ,  Wayne Eric Voice

    发明人： Daniel Clark ,  Stephen Tuppen ,  Wayne Eric Voice

    IPC分类号： C25F1/00 ,  C25F7/00

    CPC分类号： F01D25/002 ,  B23P6/002 ,  C25D3/66 ,  C25D17/007 ,  C25D17/10 ,  C25D21/02 ,  F01D5/286 ,  F05D2230/90

    摘要： A surface treatment device for applying a surface treatment medium to an article is provided with the surface treatment device having an application member for applying the surface treatment medium to the article and an electrode, which applies an electrical potential between the application member and the article. The device provides localised treatment to the article and can remove oxide layers or the like from metallic materials without removing or damaging the underlying metallic material.

    摘要翻译： 用于将表面处理介质施加到制品的表面处理装置设置有表面处理装置，该表面处理装置具有将表面处理介质施加到制品的施加构件和在施加构件和制品之间施加电位的电极。 该装置为制品提供局部处理，并且可以从金属材料中除去氧化物层等，而不会去除或损坏下面的金属材料。